Search Results for low speed

Centaur ExaMAX® backplane connector system meets industry specifications requiring higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss while minimizing channel performance variation for every differential pair.

Hi Speed Low Mating Force MIL-DTL-55302 Standard Brush Hybrids - Signal/Power/ • Coax/Fiber Optics Rack & Panel Brush Ruggedized Docking Conn./ Accessories/Install. LMD/LMS Rectangular Interconnects Other Rectangular Interconnects Introduction/ Pkg. Solutions/ Brush Contact Ruggedized VME 64x/ VITA 60, 66 Amphenol® Low Mating Force ...

Cost-effective solution that yields low crosstalk and Insertion Loss; Backward mateable to AirMax VS ® and AirMax VSe ® designs; Supports previous generation systems; Available in 3-, 4- and 5-Pair backplane and coplanar versions; Same product covers a wide range of customer applications; Available with 0.5mm or 0.4mm compliant pins

Depth, Speed, and Temperature. The DST800 is a Smart ™ TRIDUCER ® Multisensor that offers depth, speed, and temperature functions in one compact thru-hull housing. The low-profile, retractable sensor computes accurate depth, speed, and temperature data and sends it to any NMEA 2000 ® network. The wide, port-starboard, fan-shaped beam is able to find the bottom even when installed on a high ...

The DST800 is an analog Triducer ® Multisensor that offers depth, speed, and Temperature functions in one compact thru-hull fitting. The low-profile, retractable sensor computes accurate depth, speed, and Temperature data. All that is needed to receive depth, speed, and Temperature data is a single cable into a compatible network or display.

The Gen2 Paddlewheel begins delivering accurate speed reporting as low as 0.3 knots and maintains smooth speed output through 45 knots. The plastic, bronze, and stainless-steel outer housing options are compatible with all hull types. These low-profile housings are nearly flush and minimize drag with only 5 mm (3/16") extending outside the hull.

Provides low crosstalk while eliminating insertion loss resonances; Reduces mating force up to 65% compared to traditional blade and beam designs; One additional signal pin per column; Integrates high and low speed signals into the same connector; T-top pre-load and protection; Protect the beam tip during mating process; Supports multiple ...

The Gen2 Paddlewheel begins delivering accurate speed reporting as low as 0.3 knots and maintains smooth speed output through 45 knots. The plastic, bronze, and stainless-steel outer housing options are compatible with all hull types. These low-profile housings are nearly flush and minimize drag with only 5 mm (3/16") extending outside the hull.

10153126-4c2lf | Amphenol Global Search | Amphenol We offer highly automated Cable Assemblies for Low & High Speed Automotive Ethernet. High reliable and tested Cable Assemblies for standard interfaces (acc. ISO 8092-6) supporting Low Speed Ethernet 100 Mbps and 1 GBps UTP (IEEE 802.3bw), 1 GBps STP (IEEE 802.3bp / Open Alliance TC9) and High ...

UltraPass™ Internal High Speed IO. Near an ASIC to a card or board’s location in the system. Delivering a simple, low-loss, direct link to pluggable modules or anywhere in the system; High speed, low profile and high density (bandwidth / mm 2) near chip and on package solutions, the successor to our microLinkOVER™ and DensiLink™

Amphenol ICC's backplane connectors support high speed application with speeds up to 112Gb/s. Our board-to-board backplane connectors are available in right angle, orthogonal and coplanar configurations. ... HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION The Amphenol cLGA ...

Speed and Temperature The ST850 is a low-profile, retractable, thru-hull sensor that computes accurate speed and temperature data and sends it to any NMEA 0183 display or NMEA 2000 ® network. These low-profile units are nearly flush, minimizing drag with only 5 mm (3/16") extending outside of the hull.

We offer highly automated Cable Assemblies for Low & High Speed Automotive Ethernet. High reliable and tested Cable Assemblies for standard interfaces (acc. ISO 8092-6) supporting Low Speed Ethernet 100 Mbps and 1 GBps UTP (IEEE 802.3bw), 1 GBps STP (IEEE 802.3bp / Open Alliance TC9) and High Speed Ethernet - 10+GBps STP / SPP (IEEE 802.3ch).

2mm pitch for high density as well as 3mm pitch for low cost PCB quad routing; Zero skew; Optimizes PCB routing; Additional signal pin per column; Integrates high and low-speed signals in the same connector; 0.36 mm finished PCB hole for signal and 0.5mm finished PCB hole for ground; Optimizes electrical performance and aspect ratio; Integrated ...

offer a low cost alternative as our ePower-Lite Mini version which is a fit for low speed markets and low cost requirements. These attributes make the ePower-Lite robust and the interconnect of choice for the EV and Fuel Cell Vehicle markets.

Low-profile, thru-hull housing yields good display resolution at speed when installed properly; Recommended for stepped, planing, or displacement hull; Bronze housing for use in a fiberglass or wood hull; Also available in a stainless steel housing (SS175H) for use in all hull materials; Patented Xducer ID ® technology; Specifications

Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass ™ solutions, optical transceivers and more. Here is a quick review of some of our newest products.

Our cable assemblies are engineered to support everything from low-speed signal data to exceptionally high-speed data rates, required impedance-matched copper assemblies or fiber-optic assemblies. Medical professionals appreciate that our medical connectors’ passive and active latching mechanisms are available, with multiple standard color ...

Enables greater design flexibility, integrating high speed, low speed, and power in the same connector; High-speed signal PCB hole: 0.36mm and ground pin PCB hole: 0.5mm; Optimizes electrical performance and aspect ratio; Press-fit pin design; Direct mechanical connection, optimizing ruggedness and signal integrity

The OSFP footprint is optimized for signal integrity performance and built for use in high speed serial applications. The connector is en. Amphenol OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high ...