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XCede^® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.

DuraEV™ connector from Amphenol domes with 2 power and 4/6 signal pins, patented for carrying 15-70A continuous current, and supports 10,000 mating cycles.

Positronic announced today, the company has been acquired by Amphenol Corporation. This acquisition brings together industry-leading knowledge and experience in the market and provides customers with a broad range of products and technical design support for their interconnect solutions.

HIGH DENSITY POWER AND SIGNAL CONNECTOR SYSTEM. The PwrMAX ® connector family offers a compact means for connecting up to 100A DC power in modern system architectures requiring high density and high current. Configurations include coplanar, backplane, mezzanine and orthogonal. 100A per contact

The Amphenol cLGA^® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention, and ruggedness.