Search Results for matlab stacking vectors
cStack | Mezzanine Connectors | Amphenol
CUSTOMIZABLE SOLDERLESS INTERPOSER-BASED ONE-PIECE STACKER. The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
MiniStak High Density High Speed 0.6mm Board-to-Board Connector
Amphenol has developed a product series of MiniStak high-density and high-speed board-to-board connectors on a 0.6mm pitch, performing to PCIe Gen5 SI with road map to PCIe Gen6. It supports stack heights of 5.0mm, 7.5mm, and 10.0mm. These connectors support the operating current rating at 0.5A per signal contact and 1.1A per power contact.
ACS/iTRL De-Embedding Software - Amphenol CS
As a public service to the global signal integrity community, Amphenol CS is making available their improved TRL (iTRL) de-embedding software. The iTRL method overcomes many of the limitations of standard TRL.
Board to Board | Mezzanine - Amphenol CS
INNOVATIVE 56G "PINLESS" STACKER FROM Amphenol The ExaMEZZ ® connector system... OPTIMIZED FOR PERFORMANCE AND DIFFERENTAIL PAIR SIGNALING The InfinX ® high-speed mezzanine... MARKET PROVEN HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR Amphenol's NeXLev ®...
10090769 | Amphenol Global Search | Amphenol
BergStik ® FCI Basics 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row, they are available in straight or right angle options, from 2 to 72 positions.
Minitek®127 | FCI Basics | Board to Board Connectors - Amphenol CS
1.27MM / BOARD-TO-BOARD CONNECTOR / STACKING HEIGHT / WIDE RANGE / SHROUDED. Minitek127 ® board-to-board series are 1.27mm pitch connector, position ranges from 4 to 100 positions. Family comprehensive offer includes straight and right angle, surface mount and through mount, shrouded and unshrouded headers in different plating variations (gold ...
High Bandwidth | High Density Solderless Multicoax, Connectors, & Sockets
With ICFP, test engineers and reference design engineers can implement the shortest, fastest, compression mount connector technology on the planet to probe multiple signals simultaneously. • 40 GHz+ IC footprint probing • Less expensive and more robust than planar probes • Quicker and easier probing through guided alignment • No more breaking of...
Multi-Trak™ - Amphenol CS
Amphenol introduces the next-generation product - Multi-Trak™. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4 PCIe® Gen 5 and target to meet 64G PAM4 PCIe® Gen 6 and a.
GIG-Array | Mezzanine Connectors | Amphenol FCI
Amphenol's GIG-Array connectors are designed to meet the needs of applications up to 10Gb/s requiring up to 296 signal pins per connector. Amphenol's long tradition as a BGA connector innovator assures expertise and reliability in the GIG-Array BGA design.
Mezzanine Connectors for Next-Generation Applications - Amphenol CS
Amphenol ICC offers 0.50mm fine pitch MezzoStak ® connectors, which can serve a wide range of applications with comprehensive position sizes and stack heights. They are efficient in demanding environments and highly reliable.
Millipacs Mezzanine Connectors | FCI Basics | Dual Beam Tulip Contact
FCI Basics Millipacs® Vertical header and receptacle mating combination offers a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications.
Millipacs Mezzanine Connectors | Amphenol ICC
Millipacs® vertical header and receptacle mating combination offers a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications.
9952-025 | cStack Flex | Amphenol
cStack™ Flexible Circuit Assemblies, Mezzanine Connectors, cStack Flex, 6 x 25 (150 position). We may offer limited quantity of sample for this part. Click on the Check Sample (if available) button to check the allowed sample quantity in the cart. You can also purchase additional quantity in the cart or buy directly using the Buy Now button below.
NeXLev ® 12.5Gb/s High Density BGA Mezzanine Connector - Amphenol CS
MARKET PROVEN HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR. Amphenol's NeXLev ® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market proven connector in a small footprint.
GS-20-0389 Application Specification - Amphenol CS
PwrBlade ULTRA® has two options for connection to Printed Circuit Boards: Press Fit and Solder to Board. The press fit and solder tail configuration are available for all plugs and receptacles. The PwrBlade ULTRA® Solder-to-Board Power and Signal Contacts are compatible with several soldering processes, including wave soldering.
54122-114721450LF | BergStik® | Amphenol
BergStik ®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Multicoax and Coaxial Assemblies, Connectors, and Sockets - Amphenol CS
Amphenol Ardent's patented contact technologies are well suited for advanced multi-GHz applications such as board stack connectors, coaxial connectors, FPGA sockets, flex circuit connectors, probe interfaces, and mezzanine card connectors.
54112-408081150LF | BergStik® | Amphenol
BergStik ®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch. We may offer limited quantity of sample for this part. Click on the Check Sample (if available) button to check the allowed sample quantity in the cart.
10163418-0823002LF | BergStak HS™ | Amphenol
BergStak HS™ 0.5mm Board-to-Board, 80 positions, Receptacle, 12mm stack height
10164227-0403A1RLF | BergStak ® 0.40mm | Amphenol
Amphenol is one of the leading manufacturers of Board to Board Connectors. Contact us today for more details of BergStak® 0.40mm, Part Number 10164227-0403A1RLF.