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Amphenol has now introduced 2.00mm Non-ZIF flex connector with an auto-lock mechanism and surface mount termination. The auto-lock mechanism allows one-handed operation and ease of assembly. There are two versions F73W which is a vertical connector with a height of 6.25mm and F73V, the right-angle version with a height of 3.00mm.

Omni-Path is a high-performance, low latency hardware and software architecture developed by Intel that delivers signal transmission performance for tomorrow’s high performance computing (HPC) workloads, at a better performing, and cost competitive rate when compared with today’s network fabrics.

The M.2 Advantage. The USCAR compliant PCIe ® M.2 Gen 4 Card Edge Connectors from Amphenol offer a high-density, high-performance storage solution for automotive applications. With 67 contacts on a 0.50mm pitch, these connectors support a signal transmission speed of 16Gb/s. They are fully compliant with the PCI-SIG PCIe ® M.2 specification, making them suitable for PCIe ® 4.0, USB 3.0/3.1 ...

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array ...

Chameleon® 25G+ High Density Open Pin-Field Array . Latest. Meet Amphenol at IZB Oct 16, 2024. Solving Cooling Interconnects for Next-Gen Data Centers and AI Applications Oct 10, 2024. Amphenol @ 2024 OCP ... MEG-Array (2) MRD Series (2) MULTI-TRAK (2) Minitek Multipitch (2) Optical Transceivers ...

There are wide arrays of form factors designed for your needs with definite pros and cons. However, the most common types are box-shaped forms factors (SAS, SATA, and U.2) and card-shaped form factors (PCIe-based AIC, and M.2). ... MEG-Array (2) MRD Series (2) MULTI-TRAK (2) Minitek Multipitch (2) Optical Transceivers ...

MEG-Array® is offered in a variety of PCB mezzanine stack heights Amphenol Communications Solutions Metral® High Speed 1000 Series Backplane Connectors FCI Basics Metral® 1000 Series is a high-speed 2mm backplane connector system consisting of right-angle receptacles and vertical headers. ... Micro USB 3.0 (USB 3.1 Gen 1) SuperSpeed ...

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array ...

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Arranged in racks, towers, or silos, the servers (or compute) work with an array of hard or solid state drives (storage) and connect to the outside through rack-mounted switches (network). The data center customer orders each component from selected hardware vendors and integrates them into a functional unit.

2021 OCP Global Summit will be a hybrid event, the in person event will be on November 9-10, 2021 at the San Jose Convention Center and all in-person content will be live-streamed to our online platform. You can register for both in person and virtual access for the event.

From the ANSI C136.41 compliant BrightConnX™ FLA dimming receptacle for commercial and utility lighting to the BrightConnX™ FLB series base and domes, as well as the waterproof BrightConnX™ FLH Series Mini Sealed 2.50mm pitch connectors, Amphenol offers a wide array of connectors suitable for any modern lighting application.

Battery Storage System is at the heart of the ESS. Amphenol has Busbar connectors and cables as well as Input Output solutions going into 48V / 1000V / 1500V Lithium ion battery racks. Our BarKlip ® connectors offer the smallest 150A+ ESS solution in the market with a high current rating of up to 160A /200 /300A per contact @ 30°C T-Rise. With a wire range of 8AWG-0AWG, these connectors ...

The Open Compute Project (OCP) Global Summit is set to be a pivotal event for Amphenol, a leading global interconnect solutions provider. From October 17 th to 19 th, Amphenol will be at the San Jose Convention Center, unveiling an array of innovative products designed to revolutionize the world of data center connectivity.

Data and its associated storage are fundamental to any computing application, ranging from notebooks and laptops to sophisticated servers and data centers.

The Solid State Drive (SSD) market is expected to grow rapidly in 2019. Amphenol ICC’s 68 position SAS/PCIe 4.0, connectors come with 16GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers.

The 4-Row “array style” pin field allows pin-out flexibility for density and performance. Ideally suited for board-to-board applications that require high-density, high-speed, single-ended or differential signaling, Lynx™ board-to-board mezzanine connectors feature low profile, narrow footprints (pin counts from 40 to 280), reliable ...

Amphenol has recently formed a strategic IP partnership with NuCurrent, a leading global provider of wireless power systems. This collaboration aims to tackle the pressing demand within the industry for product developers to adopt the latest Qi2 standard.

Plug-and-Play Qi2 module to be available later this year. Shanghai, China and Chicago, IL – April 24, 2023 – Shanghai Amphenol Airwave Communication Electronics Co., Ltd, an operation within Amphenol Corporation (NYSE: APH) is bringing on NuCurrent, the global authority in wireless power systems, as a strategic IP partner.This partnership will address the urgent, industry-wide need for ...

Amphenol ICC launched the new Cross-Mate™ 2.00mm to mark the beginning of 2020 in January. These wire-to-board connectors offer a compact design and can be used in various applications in consumer, industrial, medical and automotive fields.