Search Results for meg-array

MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.

MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.

84502-091LF. 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array, Lead-free

High-density, high-speed, MEG-Array ® connectors offers mechanical design flexibility with wide range of position sizes and PCB stack heights. 1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high speed signal integrity at speeds up to 28Gb/s.

Amphenol is one of the leading manufacturers of meg-array. Contact us today for more details of meg-array , part number 55714-102.

84513-101LF. 100 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free

meg-array | Amphenol Global Search | Amphenol The MEG-Array ® Mezzanine Connector is a high density, high speed, discrete contact, array connector in the revolutionary BGA platform. 1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 28Gb/s. https://www ...

MEG-Array - Amphenol CS § 2.0A 30°C ∆ T (single contact energized) MECHANICAL PERFORMANCE § Durability: 50, 100, or 200 cycles § Contact Wipe: 0.80mm Nominal § IPC-SM-785 Solder Joint Reliability: 22.1 year product end-of-life :

MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.

MEG-Array®, Mezzanine, 320 Positions, Plug, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.

Amphenol has led the industry in the development and manufacturing of high-performance mezzanine interconnect systems for over 20 years. Our business specializes in high-speed, high-density interconnection solutions to solve next generation application problems.

74221-101LF | MEG-ARRAY ® | Amphenol Description. 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free. Environmental Compliance.

74221-101LF | MEG-ARRAY ® | Amphenol Description. 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free. ... 88951-101lf | Amphenol Global Search | Amphenol Amphenol is one of the leading manufacturers of meg-array. Contact us today for more details of meg-array , part number 74221-101LF.

meg-array | Amphenol Global Search | Amphenol The MEG-Array ® Mezzanine Connector is a high density, high speed, discrete contact, array connector in the revolutionary BGA platform. 1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 28Gb/s. https://www ...

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®. There are also wire termination styles that deal with how the wire is ...

The objective of this specification is to provide information to assist with the application and use of MEG-Array High Speed Mezzanine BGA (Ball Grid Array) connectors system. This specification is intended to provide general guidance for process development.

Introduction. In an era where data speeds define technological progress, Amphenol's latest innovation, the PCI Express ® DirectAttached ® CEM Card Edge Connectors, emerges as a game-changer.Engineered with cutting-edge technology, these connectors are set to revolutionize the landscape of data transmission, offering unparalleled performance and flexibility.

MEG-Array® | Mezzanine Connectors | Amphenol. The MEG-Array ® Mezzanine Connector system provides the high density and high-speed benefits of sa large array supported by the reliability and low costs of standard surface mount PCB assembly.

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array ...

High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology. Power requirements for AI model training are increasing to over 100kW per rack in some use cases, of which air-cooling fans alone account for up to 15% of server power cons