Search Results for meg-array

MEG-Array® | Mezzanine Connectors | Amphenol Flexible ground distribution; Optimized for high-speed signal integrity 32Gb/s differential pair performance documented for 4mm and 6mm stack height; Scalable, high data rates; Online s-parameter files and signal integrity performance reports; Improves design accuracy and time-to-market; 1.27mm x ...

74390-001 | Amphenol Global Search | Amphenol meg’array mum | Amphenol Global Search | Amphenol 74390-001 | Amphenol Global Search | Amphenol This specification applies to the MEG-Array 1.27mm x 1.27mm Grid High Density Connector System which provides for parallel interconnection of printed wiring boards in low power applications.

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s.

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s.

About Us. Amphenol Nexus Technologies was founded in 1961 by William H. Flanagan and Randolph K. Byers to perfect the design and manufacture of superior quality audio plugs, jacks and MIL-S-8805/3 push-button switches.

Additionally, the BergStak ® 0.80 Shielded Connectors will be featured, providing versatile interconnect options suitable for a diverse array of applications. Another notable connector is the DuraEV ™ Connector and DuraSwap ™ Connector , both engineered for both swappable and fixed battery applications, a mainstay in the automotive industry.

Title: D:SANDBOX03-02 MEG-Array customer print tolerance84501c1_V Model (1) Author: RJohnson Created Date: 3/3/2023 2:51:56 PM

Taiwan is getting ready for its biggest global technology exhibition: Computex 2024, which is set to happen from June 4 th to 7 th at the Taipei Nangang Exhibition Center Halls 1 and 2 in Taipei, Taiwan. Amongst many themes that are relevant to the time, the focus of this year is on the topic “Connecting AI”, the latest global AI technologies, and industry trends.

In the ever-evolving landscape of technology and electronics, staying ahead of the curve is imperative. Enter the PwrBlade ® Mini Cable-to-Board and Board-to-Board Connectors, an innovative addition to Amphenol's renowned PwrBlade ® product line. These connectors are set to redefine power and signal transmission in low-profile applications, offering a range of features designed to meet the ...

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is ...

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

As the electric vehicle market continues to grow, the importance of the battery pack and its component parts cannot be overstated. At the heart of the battery pack is the cell connection system (CCS), which plays a critical role in ensuring the reliable performance and longevity of the battery.

MEG-Array® | Mezzanine Connectors | Amphenol The MEG-Array ® Mezzanine Connector system provides the high density and high-speed benefits of sa large array supported by the reliability and low costs of standard surface mount PCB assembly.

PCIe ® SSDs generally use network interface cards(NIC) in transferring data among storage arrays. However, Ethernet SSD will have NIC embedded with the storage drive PCB itself. This helps to reduce the latency making data transfers direct and more efficient. ... MEG-Array (2) MRD Series (2) Mini SAS (2) Mini SAS HD (2) Minitek Multipitch ...

MEG-Array® | Mezzanine Connectors | Amphenol The MEG-Array ® Mezzanine Connector system provides the high density and high-speed benefits of sa large array supported by the reliability and low costs of standard surface mount PCB assembly.

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s.

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s.

MEG-Array® | Mezzanine Connectors | Amphenol 1.27mm x 1.27mm grid provides 71 contacts per cm2 density; Saves space; Dual-point, long wipe contacts; Easy, reliable mating; Choice of six stack heights from 4mm to 14mm and choice of eight sizes from 81 to 528 positions; The wide range of sizes and PCB stack heights increase mechanical design ...

MEG-Array® | Mezzanine Connectors | Amphenol The MEG-Array ® Mezzanine Connector system provides the high density and high-speed benefits of sa large array supported by the reliability and low costs of standard surface mount PCB assembly.