Search Results for meg-array

fci connectors | Amphenol Global Search | Amphenol 74221-101LF | Amphenol Global Search | Amphenol Search Results for 10128419-101lf 74221-101LF | MEG-ARRAY ® | Amphenol 400 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free.

Amphenol Aerospace has led the connector industry with military and aerospace power distribution connector solutions for decades. Whether it’s helping to power military ground vehicles, military and commercial aircraft systems, or the latest space launch vehicles, Amphenol Aerospace has been at the forefront of connector innovation and development.

Search Results for fpc inmeta:gsaentity_divisions=amphenol%20fci FCI Basics High-Speed flex connectors can transfer data rates up to 10Gb/s. It has a 0.30mm pitch, in-line layout and backflip actuator coupled with locking feature for strong FPC retention.High-speed FPC provides a low profile and compact solution while maintaining high-speed ...

ms3112e10-6s end of life | Amphenol Global Search | Amphenol Search Results for c10 -779621-0001 - Amphenol. Search Results for c10. Our wide array of electrical and electronic connectors come in multiple form factors and are designed to meet the latest market needs including high power, high speeds, size and weight reduction, EMI shielding ...

Amphenol Aorora is now part of the Amphenol Family. Amphenol ICC is extending our product portfolio of BTB/FFC/FPC connectors with the acquisition of Aorora Technology Co. Ltd. Based in Huizhou, China with 450 employees, Aorora, was founded in 2003 by Mr. Luo Liwen (CEO).

Amphenol will be displaying a wide array of industrial connectors at electronica India 2024 that are specifically designed, as the name suggests, for industrial applications. They are ruggedized to perform in harsh conditions of factories, and outdoors, and withstand high temperature, vibration, and dust ingress. ... MEG-Array (2) MRD Series (2 ...

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.

Mini Cool Edge IO provides not only a SI performance ready signal transmission medium but also a new way of system design thinking that will lead your electronic system to a completely cost-effective, highly modularized, and extremely easy-to-repair system.

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s.

The quest for speed, reliability, and innovation is relentless in the ever-evolving landscape of connectivity solutions. As industries race toward the future, the demand for high-speed interconnects capable of handling the data deluge becomes more pressing.

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets.

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

The new GOST Apparition Security, Monitoring & Surveillance Package includes everything that the GOST Apparition SM comes with as well as the NEW GOST Watch HD XVR “Next Generation all in one” video recording system that can accommodate up to eight 1080P HD or analog cameras over coaxial and/or ONVIF protocol IP cameras and save up to 3 months of footage with a four terabyte hard drive, 2 ...

MEG-Array® | Mezzanine Connectors | Amphenol The MEG-Array ® Mezzanine Connector system provides the high density and high-speed benefits of sa large array supported by the reliability and low costs of standard surface mount PCB assembly.

Amphenol ICC is launching the next generation high-speed ruggedized connectors for future industrial ethernet communication designs. We have collaborated with key interconnect technology partners Hirose Electric and Harting Technology Group to release the new ix Industrial ™ series of connectors. The IEC 61076-3-124 compliant ix Industrial ™ connectors are ideal for various applications in ...

Peripheral Component Interconnect Express (PCIe ®) is the most common standard for high speed interface that connects various server and storage components with the motherboard.Amphenol has an array of Card Edge connectors supporting PCI Express ® Gen 3, Gen 4 and Gen 5 standards along with PCIe ® M.2 Connectors which provide high performance and differential signaling in low profiles.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

10154028-101lf EXAMAX2® 112Gb/s High Speed Backplane Connector 92Ω, 8-Pair, 16 column, 416 position, Right Angle Receptacle, No Guide Pin. ... 32 10130566-101LF: 10125530-101LF 10: 40 10122655-101LF: 10123536-101LF 5: 8 40: 10128702-101LF 10128706-101LF: 10 50: 10122665-101LF 10123529-101LF: PART NUMBERS *0.5mm standard press-fit pin is the ...

In the fast-paced world of modern electronics, the demand for compact and lightweight devices continues to soar. Flex-to-board connectors enable flexible and high-density interconnects between printed circuit boards (PCBs), LCDs, and various electronic components. As a result, they are increasingly adopted in automotive, smartphones, tablets, laptop PCs, wearables, robotics, and medical ...

Amphenol is excited to exhibit at the 2022 OCP Global Summit, the largest gathering of key decision-makers, executives, engineers, developers, and suppliers who support open source and open collaboration in hardware and software.. The theme for this year is “Empowering Open”. From hyperscalers to enterprises and government, today everyone is looking at open collaboration from researching ...