Search Results for meg-array

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets

MEG-Array® R+ 56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. Next-generation differential pair contact design for up to 56Gb/s PAM4 and NRZ performance.

Shanghai Amphenol Airwave Communication Electronics Co., Ltd, a subsidiary of Amphenol Corporation has partnered with NuCurrent, a global player in wireless power systems. This partnership will address the need to shift toward new standards such as Qi2 (pronounced “cheē tü”) standard. “Our partnersh

NUMBER CATEGORY GS-20-033 APPLICATION SPECIFICATION TITLE PAGE REVISION MEG-Array® High Speed Mezzanine Connectors 7 of 23 J GUARDIAN (VERIFIED BY) DATE Robert Brown 04/27/16 APPROVED BY Robert Marshall CLASSIFICATION :

74390-001 | Amphenol Global Search | Amphenol GS-01-001 1.0 OBJECTIVE The objective of this specification is to provide information to assist with the application and use of MEG-Array® High Speed Mezzanine BGA (Ball Grid Array) connectors system. This specification is intended to provide general guidance for process development.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

CompactPCI ® is a highly successful architecture since its formation in the 1990s. This offers ruggedized, Eurocard-based form factor around Intel’s PCI architecture. These were basically used in telecom and datacom applications and later CPCI became a top choice for air and conduction-cooled implementations in military applications.

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets

The HSD connector system (High-Speed Data), compliant with USCAR-2 specification, is a fully shielded interconnect system designed for transmitting high-performance digital signals at low voltages. It is built to prevent interference from both external sources and crosstalk. This system is widely used in various functions in automobiles such as ADAS, Body Control Units, Cameras, GPS, Security ...

Amphenol Sine Systems 44724 Morley Drive, Clinton Township, MI 48036 USA www.amphenol-sine.com 10-2023 Machined Contacts, Sockets & Pins Part Number DescriptionSize AWG Type AT60-215-1631 Male Contact - Pin, Gold-plated 1614 Machined AT62-209-1631 Female Contact - Socket, Gold-plated 16 14 Machined AT60-215-16141 Male Contact - Pin, Nickel ...

the connector body. The two capacitor types commonly used in filter connectors for military or avionics applications are planar arrays and tubular capacitors. Each of these capacitor types is an efficient filter at high frequencies (> 1 GHz) and has been proven to be extremely reliable when suitably assembled into a connector.

R-VPX Evolution 2.0 series connectors are designed and optimized to achieve data rates in excess of 25 Gb/s, meeting VITA 46.30 requirements. View Product VITA 66.1 and 66.4 Ruggedized blind-mate optical MT Module/Backplane connector systems designed to meet the VITA 66.1 and 66.4 open architecture specifications. ...

Amphenol is a leading supplier of advanced interconnect systems, sensors and antennas for a growing array of automotive applications. In addition, we have developed advanced technology solutions for hybrid and electric vehicles and are working with leading global customers to proliferate these advanced interconnect products into next-generation ...

Millipacs Backplane Connectors. Compliant with IEC 917, IEC 61076-4-101 industry standards, and offering a 2.00 mm grid interconnection system, Millipacs ® is ideal for rugged environments. With features like two-beam twisted tulip contacts, EMI shielding, coding, guiding, and high operating temperature capabilities, these connectors excel in demanding medical-surgical applications, serving ...

MEG-Array - Amphenol CS leveling and self-centering. 1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high speed signal integrity at speeds up to 32 Gbps. § High density, high speed, dual-point contacts § 32 Gbps performance documented for 4mm and 6mm stack heights § 1.27mm x 1.27mm grid, 71 ...

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s.