Search Results for mezzanine connector

End Two connector options (SMA, 2.92mm, 1.85mm, SMP, TR) Easily integrates with other off-the-shelf components utilizing legacy connectors; Wide selection of component material options; Materials intentionally selected to meet outgassing, mass, and Ka/Ku band criteria

Amphenol ICC has led the industry in the development and manufacturing of high-performance mezzanine interconnect systems for over 20 years. Our business specializes in high-speed, high-density interconnection solutions to solve next generation application problems.

Amphenol offers board-to-board solutions for every industry standard application. XCede and AirMAX are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G.

ExaMEZZ® Mezzanine connector system meets industry specifications requiring higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss while minimizing channel performance variation for every differential pair.

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS . FCI Basics BergStak ® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.. Housing and terminal profile guarantees support of up to 12Gb/s . Vertical versus vertical mating configuration

Amphenol's GIG-Array ® connectors are designed to meet the needs of applications up to 10Gb/s requiring up to 296 signal pins per connector. Toggle Nav ... Optimized design for utilization in high-density, high-speed mezzanine applications; Market-proven and trusted, high-performance solution; Ball Grid Array (BGA) termination;

Standard and custom flex circuit and connector designs are available. cStack™ Flex Cables | Mezzanine Connectors | Amphenol Amphenol's cStack flexible circuit assemblies are designed for applications where flexibility, space, weight and performance are critical.

10132798-022110LF. BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 20 position, 2.7mm height receptacle connector.

Mezzostak® 0.5mm from FCI Basics is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. JavaScript seems to be disabled in your browser.

Millipacs ® vertical header and receptacle mating combination offers a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs ® connector interfaces provide high reliability and robustness making it suitable for the most demanding applications in aerospace, industrial and also traditional telecom segments.

Amphenol's ICFP offers 50 Ohms access to IC contact pads and signal paths on an IC circuit footprint.

Lynx^™ QD - The Quad Differential Solution is optimized for differential pair signaling. This innovative interconnect solution supports data rates of 56Gb/s PAM4 with a 4-row differential sign.

The Mezzanine Connector, SK Series Chip-to-Board Socket from Amphenol offers high performance with patented compression mount technology, supporting up to 40GHz speed and 0.4mm pitches for cutting-edge ICs.

Mezzanine. Signal. Floating. Card Edge. Wire/Cable/Flex to Board. Signal. Power. Flex to Board. Wire to Wire. Blind-mate. High Voltage. Hand Tool. Power. Power Supply. Backplane. Busbar I/O. ... Mini Cool Edge IO. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 64G PAM4/PCIe® Gen ...

Power and signal hybrid connectors; Supports wide range of current rating and voltage requirements; Modular tooling design; Limitless combinations of high power + low power + signal contacts; Mezzanine stack heights from 8mm - 20mm; Tooled in 1mm increments to fit low profile requirements; High power & low power contacts based on proven ...

BergStak+™ 0.80mm by FCI Basics is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is completely compatible with the existing BergStak® 0.80mm and support up to 16Gb/s performance.

Robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high reliability applications . and demanding environments. Innovative hermaphroditic design provides a precise . mating interface with extra housing guidance. Reduced product mix simplifies customer connector . qualification, documentation and maintenance.

The distance between the two stacked interconnected boards is called stack height. When it comes to mezzanine connectors, stack height is very important. Backplane connectors that have been adapted to mezzanine applications typically have stack heights from 15mm to 55mm. Amphenol’s Board-to-Board Connectors

BergStak+ 0.80mm is designed to be the next generation PCIe® 4.0 compliant mezzanine connector system. It is fully compatible with the existing BergStak® 0.80mm product recommended by the Open Compute Project \(OCP\). Keywords: BergStak+ Connectors; BergStak Plus Connectors; Mezzanine Connector Created Date: 5/15/2023 11:41:06 AM

Amphenol is one of the leading manufacturers of Board to Board Connectors. Contact us today for more details of BergStak 0.5mm Mezzanine Connector, part number 10147445-042200LF