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DesignCon, the largest event for Chip, Board, and Systems Design Engineers, brings together the brightest talents across the world. This premier gathering has the legacy of more than two decades in solving the signal and power integrity challenges and creating innovative design solutions for tomorrow.

Solving Cooling Interconnects for Next-Gen Data Centers and AI Applications Oct 10, 2024

Everything under computing undergoes rapid innovation to meet the demand of both speed- and performance-hungry technologies. High–speed Solid State Drives (SSDs) meeting the most modern and advanced memory standards are already in use.

The 5G spectrum is enabling a new arena of intelligent infrastructure and a fully connected world. To meet the demanding requirements of modern mobile connectivity, each 5G component is redefined with enhanced performance, flexibility, scalability, and efficiency. We have discussed in our previous articles how Amphenol supports the strategic changes put forth by the fifth generation of ...

The Expected Rise of Machines The past decade has witnessed massive advancements in hyperscale datacenters and rise in connected devices leading to the annual global data growth exceeding several trillion gigagbytes.

Amphenol offers most reliable 2mm Hardmetric series Millipacs ® Backplane connectors.. With high-reliability features, stacking, standard length modules, EMI top & bottom shielding, hot swapping capability, density, and durability Amphenol’s Millipacs ® is one of the best solutions available in the industry for rugged and reliable applications in multiple industrial segments.

Amphenol ICC’s InfinX® is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX® is the best choice for high speed board-to-board applications.

Amphenol’s standardized Book 20 FLM Series connectors allow modules to connect to the LED driver and control system, and for modules to be easily field serviced and replaced as necessary.

The stage is set, and Amphenol is all geared up to showcase its trailblazing technologies at Electronica India 2023, to be held from September 13 th to 15 th in Bangalore, India.This premier event promises to be an exhilarating showcase of the latest advancements in the electronics industry, and you can catch us in Hall 5 – Booth #EE91.. Unveiling India Manufacturing Capabilities:

Come visit us at OCP CHINA DAY, Booth #B09 at the Beijing Kerry Hotel, on August 10th, 2022. Please use our special invite code “AMPHENOL” to register for the conference.

With many applications like AI, data analytics, machine learning, and image recognition getting mainstream, the demand to process and transmit massive data securely in the least time is increasing.

OFC is the most comprehensive and largest conference and exhibition for optical communications and networking. It is the go-to place to visit and interact with hundreds of manufacturers on their latest products and innovative solutions and to understand on the trends that drive the market.

Engineers can design faster with free E-CAD and M-CAD models for Amphenol Communication Solutions (ACS) connectors available on the Amphenol . San Francisco, CA – (September 27, 2022) - Amphenol Communication Solutions, a world leader in interconnect solutions and SnapEDA, the first search engine for electronic design, are releasing over 21,000 new digital models to help designers bring ...

Amphenol’s latest addition to its list of interconnect solutions with best-in-class mechanical and signal integrity performance is the DensiStak ™ Board-to-Board Connector.This connector is a solution that addresses the need for flexible pin design, high-density and compact interconnects, especially in challenging environments like automotive applications.

FlexFast ™ Flex-to-Board: Gold plating process for terminals: Reduces the force required for the mating and un-mating process ensuring smooth connections. Max 8.00mm height: This feature is a space-saver as it allows for designs in compact applications. Connector Position Assurance (CPA) & Flex Position Assurance (FPA): Ensures connectors are properly mated, and locked together as well as ...

Amphenol being a leader in the industry is all set to showcase our most advanced products in electronica China 2021. This article discusses our range of connectors that go into modern Medical equipment and Datacenters.

Amphenol ICC creates customized solutions to meet the specific needs of our customers. Recently, a traditional PCB midplane system required an improvement in SI performance. Twinax cables provided the SI improvement but resulted in a mechanical challenge.

ComboLock ® connectors are very compact with a 1.00mm signal pitch and a 3.00mm power pitch, saving board space and hence a great choice for small, sleek modern-day applications. In addition, as these connectors integrate both power and signal currents into one connection system, it meets the growing demands of miniaturization.

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Amphenol will be participating in the Data Center World at Austin Convention Center in Austin, Texas this coming May. The expo will take place at the following times and you can find Amphenol in booth #847.