Search Results for multi-trak

PCIe ® (peripheral component interconnect express) is an interface standard for connecting high-speed components in a computer or server. Basically, it is how all major components inside a computer talk with each other. Those components include CPUs, GPUs, SSDs, Hard Drives, Sound Cards, and Wi-Fi Cards, among others.

Our Power Solutions team is equipped with the widest range of configurable power products in the market today and is dedicated to fulfill your custom power connector needs.

The introduction of 224G PAM4 technology plays a pivotal role in the evolution of data center connectivity. With unprecedented speed, enhanced bandwidth, and robust system architecture, this Gigabit Ethernet solution is set to redefine the capabilities of data centers, enabling them to keep pace with the rapidly advancing landscape of AI and data-intensive applications.

Amphenol is set to participate in the ECOC 2024, one of the premier events in the fiber optic communication technology industry. The European Conference on Optical Communication or the ECOC 2024, is scheduled to take place from September 22-26, 2024, at the Congress Center Messe Frankfurt in Germany. Celebrating its 50th anniversary, ECOC 2024 will bring together over 1,600 attendees, 30 ...

With rapid developments in industrial automation, PLC or Programmable Logic Controllers are being an essential part of any manufacturing environment. A PLC generally has a PLC Rack, Interface Module, Communication Module, CPU Module and a Power Supply Module.

Ever since, these flash memory cards have pedaled through various evolutions in the process of meeting the industry trends. The latest addition to this family is the microSD Express, which is expected to escalate the future of our data-hungry world to the next level.

Amphenol ICC is one of the earliest adopters of USB 3.1 Gen 2 Type C connector. This newest USB standard supports scalable power delivery up to 100W and performance speed up to 10Gb/s.

From low to medium, high to ultra-high-speed, Amphenol ICC offers a versatile range of backplane connectors that suit almost all applications.

The latest high-speed internal I/O solution from Amphenol for OCP DC-MHS is the Multi-Trak™ connector. Combining the original PCIe ® and Mini Cool Edge IO in one connector, the Multi-Trak™ supports power solutions with DIP type for a total 21A and high/low-speed signal.

SSDs are much similar to HDDs when it comes to functionality, but it offers two advantage such as its capability to retain data even when there is no power, and perform much faster, more efficient and reliable – even when compared with the flash memory chips in USBs.

Plug-and-Play Qi2 module to be available later this year. Shanghai, China and Chicago, IL – April 24, 2023 – Shanghai Amphenol Airwave Communication Electronics Co., Ltd, an operation within Amphenol Corporation (NYSE: APH) is bringing on NuCurrent, the global authority in wireless power systems, as a strategic IP partner.

Amphenol ICC has a broad array of innovative technology and solutions to support Industry 4.0 and the Automotive industry. Come see the star products in our Industrial and Automotive showcase:

Search Results for multi-trak Tag Archives: ND9 Series - Amphenol CS Industry 4.0 and IIoT (Industrial Internet of Things) is enabling a shift from a hierarchical factory and process automation control model to a decentralized, fully IP addressable network like the Cloud to the factory floor.

Amphenol Ardent Concepts, a leading supplier of ganged coaxial connectors for use in cryogenic environments, has released high-density Ganged Coaxial Attenuators for use in-line with the TR Multicoax TM series to support the many unique challenges of scaling up quantum computing applications for practical use.

When it comes to the digital age consumers, comfort and convenience are never compromised. Modern ML not only recognizes but predicts. AI algorithms can predict possible failures and prevent their occurrence in myriads of applications ranging from navigation assistance that helps us with a quick com

Amphenol ICC’s FFC/FPC connectors, BergStak® 0.50mm board-to-board connectors, Minitek® 1.00mm wire-to-board connectors and Micro USB connectors go into these speakers.

Hyperscale computing refers to the facilities required in distributed computing environments to efficiently scale from a few severs to thousands, and is commonly used in environments such as Big Data and Cloud Computing.

In September, Amphenol ICC launched 4 new products. PwrMAX ® G2 is the highest density blind mate power and signal connector available in the market today and Mezzostak ® 0.50mm with an innovative hermaphroditic design is a robust fine-pitch mezzanine connector solution. While IPS series offer an integrated cable solution for high-speed card edge connectors like PCIe, the new MXM connector ...

Amphenol ICC’s solutions meet or exceed data center convergence expectations. HCI’s non-volatile memory specs call for connectors like U.3 based out of SFF-TA-1001 and Mini Cool Edge based out of SFF-TA-1002 standards.

Since receiving Telcordia approval in 2017, Amphenol ICC has been busy getting Chameleon ® ready to enter new markets and designs. Chameleon ® now has 14 standard configurations in 6mm and 10mm stack heights and lead time on these configurations is 8 weeks.. Have you heard the latest on Chameleon ®?If not – read on – there’s a lot that’s new with the most flexible, custom configured ...