Search Results for multi-trak
Industrial Automation with Robotic Arms - Amphenol CS
Robots were primarily designed to do tedious, repetitive works that were difficult and dangerous for humans to handle or those tasks that required consistent precision. Robotic arms are the most popular robots used in industries today.
Tag Archives: Ardent - Amphenol CS
Amphenol Ardent Concepts, a leading supplier of ganged coaxial connectors for use in cryogenic environments, has released high-density Ganged Coaxial Attenuators for use in-line with the TR Multicoax TM series to support the many unique challenges of scaling up quantum computing applications for practical use.
Tag Archives: Automotive - Amphenol CS
In the fast-paced world of modern electronics, the demand for compact and lightweight devices continues to soar. Flex-to-board connectors enable flexible and high-density interconnects between printed circuit boards (PCBs), LCDs, and various electronic components. As a result, they are increasingly
Key Features of Intelligent Buildings - Amphenol CS
Amphenol ICC offers a wide range of connectors that support applications in intelligent buildings. While connectors like BergStak® 0.50mm, Minitek127® and MezzoStak™ 0.5 goes into security systems, Griplet® , Minitek®, and RotaConnect® BTB go into downlights.
Tag Archives: FloatCombo - Amphenol CS
An on-board charger (OBC) is a device mounted inside the electric vehicle that converts AC power from an AC source into practical DC form, and its primary function is power conversion.
Enhanced Connectivity for 5G Networking - Amphenol CS
Multi-Trak (1) Multipitch 1.25mm (1) ND9 Series (1) NEPCON (1) NEPCON Japan (1) National Intern Day (1) Network (1) PCE (1) PCIE Gen 5 connetcors (1) PCIe 6.0 (1) PCIe Card Edge Connectors (1) PCIe DirectAttached (1) PCIe Gen 4 & Gen 5 CEM connectors (1) PCIe Gen 5 CEM Connector (1) PCIe Gen 5 CEM Connectors (1) PCIe M.2 Gen 5 Connectors (1 ...
Tag Archives: LVDS - Amphenol CS
Multi-Trak (1) Multipitch 1.25mm (1) ND9 Series (1) NEPCON (1) NEPCON Japan (1) National Intern Day (1) Network (1) PCE (1) PCIE Gen 5 connetcors (1) PCIe 6.0 (1) PCIe Card Edge Connectors (1) PCIe DirectAttached (1) PCIe Gen 4 & Gen 5 CEM connectors (1) PCIe Gen 5 CEM Connector (1) PCIe Gen 5 CEM Connectors (1) PCIe M.2 Gen 5 Connectors (1 ...
What are the top differences between DDR4 and DDR5? - Amphenol CS
Data and its associated storage are fundamental to any computing application, ranging from notebooks and laptops to sophisticated servers and data centers.
OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module ...
Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared ...
Monthly Archives: November 2023
In the ever-evolving landscape of technology and electronics, staying ahead of the curve is imperative. Enter the PwrBlade ® Mini Cable-to-Board and Board-to-Board Connectors, an innovative addition to Amphenol's renowned PwrBlade ® product line. These connectors are set to redefine power and signal transmission in low-profile applications, offering a range of features designed to meet the ...
type | Amphenol Global Search | Amphenol
Amphenol introduces the next-generation product - Multi-Trak™. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4 PCIe ® Gen 5 and target to meet 64G PAM4 PCIe ® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to ...
Tag Archives: VCU
Multi-Trak (1) Multipitch 1.25mm (1) ND9 Series (1) NEPCON (1) NEPCON Japan (1) National Intern Day (1) Network (1) PCE (1) PCIE Gen 5 connetcors (1) PCIe 6.0 (1) PCIe Card Edge Connectors (1) PCIe DirectAttached (1) PCIe Gen 4 & Gen 5 CEM connectors (1) PCIe Gen 5 CEM Connector (1) PCIe Gen 5 CEM Connectors (1) PCIe M.2 Gen 5 Connectors (1 ...
Amphenol at ODCC Summit 2022
The annual ODCC Summit is one of China’s leading Data Center events. Amphenol as an active member of the ODCC Committee will showcase our latest technologies, solutions, and achievements in the China data center industry this year. The 2022 ODCC Summit will be held in Beijing International Conventi
The Complete Omni-Path Architecture Interconnect Solutions - Amphenol CS
Omni-Path is a high-performance, low latency hardware and software architecture developed by Intel that delivers signal transmission performance for tomorrow’s high performance computing (HPC) workloads, at a better performing, and cost competitive rate when compared with today’s network fabrics.
Tag Archives: Artificial Intelligence
Taiwan is getting ready for its biggest global technology exhibition: Computex 2024, which is set to happen from June 4 th to 7 th at the Taipei Nangang Exhibition Center Halls 1 and 2 in Taipei, Taiwan.
Tag Archives: Busbar connectors - Amphenol CS
Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today, the release of its BarKlip ® BK500 IO and BarKlip ® BK150 IO busbar connectors. These high-current connectors are fully compliant with OCP ORv3 power output and IT gear specifications supporting 48V power rack architecture
Visit Amphenol at Avnet Future Mobility Asia 2023
Ve-NET™ Automotive Multi-Gigabit Differential Connector System . Latest. Exploring the Future of Storage with EDSFF E1/E3 High-Speed Solutions Jul 18, 2024. ... MULTI-TRAK (2) Minitek Multipitch (2) Optical Transceivers (2) Optics (2) PCIE GEN 6 MINI COOL EDGE IO (2) PCIe Gen 5 Flip CEM (2) Press-fit Termination (2)
Visit Amphenol at DesignCon 2020 | Booth #731 | 28 - 30 January 2020
January 28 th to 30 th, DesignCon 2020 will include three jam-packed days of technical training at conference sessions and a 14 track educational conference. There will be more than 175 exhibiting companies at the Expo.
Tag Archives: SlimSAS - Amphenol CS
Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared ...
Amphenol ICC New Products Updates – April 2019
Minitek ® 2.00mm Blind Mate Interface (BMI) Connectors. Minitek ® 2.00mm is the smallest pitch BMI connectors, similar to the existing Minitek ® Pwr 3.00mm BMI and Minitek ® Pwr 4.20mm BMI.These flexible and comprehensive connector solution is designed for applications that require a current rating up to 2A per circuit and also provides an ideal solution for panel-to-board applications.