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As the tech world converges in the heart of innovation at the Santa Clara Convention Center on January 31 st and February 1 st, 2024 for DesignCon, Amphenol will make a mark with pioneering solutions in interconnect technologies at Booth #833.. Date: January 31 st and February 1 st Time: 11 AM - 6 PM Venue: Santa Clara Convention Center, Great America Parkway, Santa Clara, CA

wwwapenoccco Disclaimer Pease note tat te above noraton s sbect to cange tot notce TECHNICAL INFORMATION PCI Express® Gen 3 Card Edge Connectors MATERIAL § Contact Base Metal: Copper alloy § Contact Area Finish: Gold over nickel § Solder Area Finish: Tin over nickel or tin-lead over Nickel § SpecificationMetal Board Locks: Copper alloy § §Board Locks Finish: Tin over nickel or tin-lead ...

FCI Basics Minitek127® standard board-to-board connector is the improved 1.27mm pitch modular system. The halogen-free product includes the straight, right-angle, and surface mount, post option for surface mount, different plating variations, and position numbers up to 100.

InfiniBand stands tall as a stalwart in the realm of high speed computing interconnect solutions. With its high bandwidth, low latency, and support for multiple topologies, InfiniBand is a go-to choice for clusters handling intensive computational tasks.

Optical Splitter Components. Amphenol Network Solutions offers a complete line of discrete Optical Splitter Components for a wide range of uses in various optical network designs.

Amphenol Corporation (NYSE: APH) today announced that its Board of Directors approved a two-for-one stock split to be paid in the form of a stock dividend. Each Amphenol shareholder of record at the close of business on May 31, 2024 will receive one additional share for every share held on the record date. Amphenol expects the additional shares will be distributed on June 11, 2024.

Amphenol as an industry leader in the advancement of connector technology is a part of various standards committees, and actively engages to promote evolving standards by contributing our designs. Our interconnects are compliant with major industry standards in their respective areas.

Features. Fully compatible with IEEE802.3ba and Infiniband QDR & FDR specifications; 100 ohm differential impedance system; Allows for 10Gb/s & 14Gb/s per channel transmission; aggregate of 120 Gb/s & 168 Gb/s total bandwidth

Amphenol’s 100G QSFP28 optical modules include SR4, AOC, AOC break out, CWDM4, LR4, ER4 Lite, ER4 and ZR4 series, which adopt LC or MPO optical ports

In this blog, we delve into the remarkable features, benefits, and significance of ExaMAX2®, the next-generation connector system that promises to redefine the standards of data transmission.

Mini Cool Edge is a 0.60mm high density, high-speed card edge connector for new generation small form factor system. Mini Cool Edge 0.60mm meets SFF TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications.

Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass ™ solutions, optical transceivers and more. Here is a quick review of some of our newest products.

RF Connector HD-BNC Straight Crimp Jack Belden 1855A Belden 4855R Belden 4855P Bulkhead Rear Mount 75 Ohm IP67 12G Optimized

2020 ANNUAL REPORT 1 2020 Financial Highlights1 For the Years Ended December 31 2020 2019 2018 In millions, except per share data Net sales $8,599 $8,225 $8,202