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The Evolution of PCI Express® - Amphenol CS
PCI-SIG has already announced the progress of PCI Express 6.0 specification which is expected to launch by early 2021 doubling the data rate to 64GT/s. Amphenol ICC has supported these improvements in developing solutions for each generation and has evolved along.
PCI Express® Gen 4 & Gen 5 Card Edge Connectors - Amphenol CS
Amphenol PCIe Gen 4 & Gen 5 CEM connectors meet and outperform industry standard PCIe 4.0 & 5.0 (Proposed) requiring higher speed performance. The optimized series supports backwards mating and is footprint compatible with PCIe 3/2/1.
Profiling Connectivity in Machine Learning Applications - Amphenol CS
We're interested in knowing about NVLink proprietary technology from Nvidia, and its associated hardware platform called DGX-2. It’s been touted as a faster and more scalable alternative to PCIe. In this light, would you think that NVLink would mark a disruptive growth, outdoing PCIe?
Our history - Amphenol Socapex
Step into the past and explore the fascinating story of Amphenol Socapex, starting from its creation in 1947. Learn about our journey from the beginning as a helmet manufacturer for the French army to becoming a worldwide leader in connectivity solutions. Socapex Ponsot is founded by Henri Ponsot.
Industry's First Pole Mounted Multi-Access Edge AI and Machine Learning ...
The solution is being demonstrated at the NVIDIA GPU Technology Conference (GTC), March 19-21, at the San Jose McEnery Convention Center in Booth #317. The new solution is a compact low profile pole or wall mountable unit based on an integration of ADLINK’s latest AI Edge Server MECS-7210 and Charles’ SC102 Micro Edge Enclosure.
Amphenol’s Connectivity Solutions for AI and ML
Amphenol’s Mini Cool Edge 0.60mm connector is well-suited for AI and ML applications due to its high density and high-speed capabilities. It meets specifications such as SFF-TA-1002, Gen Z, EDSFF, and OCP NIC 3.0, making it compatible with various industry standards.
2024 Wrapped: What’s the Buzz at Amphenol this year?
With a focus on innovation and pioneering technology in mind, we have launched amazing new product series and expanded our portfolio of applications.
OverPass™ Internal High Speed Interconnect - Amphenol CS
UltraPort SlimSAS ®. SFF-8654 Form Factor; Industrial Standard of: - Intel UPI (11.2G) - NVIDIA NVLink (25G) - SAS-4 - OpenCAPI; PCIe 4.0/5.0 supported
Amphenol showcases its leading high speed interconnect at DesignCon 2024
Amphenol's XGIGA team will be publicly debuting a Linear Optics solution at DesignCon this year with their OSFP800-DR8 module. Linear Pluggable Optics (LPO) has created a buzz across the industry as data centers look to take advantage of the incredible performance capabilities from 112 Gb/s silicon.
High Speed Backplane Connectors - Amphenol CS
Early in the design cycle, Amphenol helps customers understand important design trade-offs with integrated backplane system solutions that meet increasing bandwidth needs by optimizing the entire signal transmission path and boosting channel performance.
Upcoming Events - Amphenol CS
Amphenol CS is an active participant in events and exhibitions related to the industry and has a global recognition. Come visit us and meet our experts to learn how our products can make tomorrow's technology.
A Deep Dive into High-Speed Computing Server Interconnect Solutions
From intricate scientific simulations to real-time data analytics and artificial intelligence applications, the need for faster, more efficient server interconnects has become paramount. The race to optimize data processing and communication to these technologies has given rise to the requirement for myriads of server interconnect solutions.
FCI Basics | Wire-to-Board, Board-to-Board | Input/Output, FFC/FPC ...
We offer interconnection systems from 2.54mm pitch down to 0.40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ®). Mezzanine, coplanar, perpendicular configurations and features such as self-aligning and floating capabilities are also available like different stack heights to cover all needs.
Amphenol releases ExaMAX2® Gen2 to unlock AI hardware computing power ...
Shanghai, China, July 11, 2023 - Amphenol, the global connector leader, announced the launch of a new product ExaMAX2 ® Gen2 at the 2023 Electronica China. As an enhanced version of the ExaMAX2 ® family, ExaMAX2 ® Gen2 offers significant performance improvements over the previous generation.
Amphenol at OCP China Day 2022
We also have our technical expert Michael Yang who will discuss data center connection trends with experts from AliCloud, NVIDIA, Inspur, and Keysight from 3:30 PM to 4:00 PM.
PCI Express ® Gen 3 Card Edge Connectors - Amphenol CS
Amphenol's 1.00mm pitch, vertical card edge connectors enable PCI Express (PCIe) signalling from 2.5Gb/s (Gen 1) and 5Gb/s (Gen 2) up to 8Gb/s (Gen 3) per differential signal pair. A modular design of these connectors allow standard pin counts like 36, 64, 98, 164 and 280.
224G High-Speed Solutions - Amphenol CS
What constitutes a 224G solution? At this early stage there could be many paths to a 224G solution. Amphenol has several solutions that are well-positioned to support the development effort. These solutions support a wide range of architectures solving reach, density, and thermal challenges.
OverPass™ Cabled Backplane | High Speed - Amphenol CS
Amphenol CS offers high-speed cabled backplane solutions meeting 112G PAM4 PCIE SFF-TA-1016 standards supporting cable mating with backplane cable, press fit headers, right angle and orthogonal configurations.
Hyperscale Computing: Innovation for Data Centers
Hyperscale computing refers to the facilities required in distributed computing environments to efficiently scale from a few servers to thousands, and is commonly used in environments such as Big Data and Cloud Computing.
Amphenol's Game-Changing 112 Gb/s Backplane Interconnect Technology
With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.