Search Results for osfp

Amphenol is set to participate in the ECOC 2024, one of the premier events in the fiber optic communication technology industry. The European Conference on Optical Communication or the ECOC 2024, is scheduled to take place from September 22-26, 2024, at the Congress Center Messe Frankfurt in Germany.

The SSD market is expected to take a giant leap in 2020 with the increased demand for cloud applications and the improvement in technology like 5G connectivity. Amphenol offers a wide range of solutions to support different types of SSD.

Amphenol ICC provides a wide range of connector solutions for all types of video surveillance cameras. Our RJMG connectors with Power over Ethernet (PoE) capabilities interface the recorders with the video outlets.

Memory standards have always been a factor determining the performance of a system. Over time, it has gone through constant updates from SDR, or Single Data Rate RAM to the recent DDR or Double Data Rate.

Join us at the Avnet Green Days: e-Mobility 2023 event in Hanoi and Ho Chi Minh, Vietnam, from October 24th to October 27th, to witness the unveiling of Amphenol's cutting-edge automotive technology solutions.

ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124) is now added to the list of CC-Link IE TSN Specifications Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today that the CC-Link IE TSN Specification List for March 2023 will now include ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124).

0.50mm FFC/FPC Connectors. The 0.50mm pitch FFC/FPC connectors come in multiple heights and are vibration-proof. These connectors offered with top, bottom, dual beams and dual contact positions in both ZIF (Zero Insertion Force) and Non-ZIF cable terminations utilize 0.50mm contact spacing to terminate mobile devices across a variety of applications.

The changing trends in technology are demanding applications that can withstand a harsh environment that involves exposure to dust, splashing water or cleaning solutions over the course of their lifetime.

additional assemblies - odc to dlc/aopc length, m model number 3 fojbf-on01s-003m 5 fojbf-on01s-005m 10 fojbf-on01s-010m 20 fojbf-on01s-020m additional assemblies - odc to dlc/aopa

additional assemblies - odc to dlc/aope length, m model number 3 fojbf-ope01s-003m 5 fojbf-ope01s-005m 10 fojbf-ope01s-010m 20 fojbf-ope01s-020m additional assemblies - odc to dlc/sfp

In the fast-paced world of modern electronics, the demand for compact and lightweight devices continues to soar. Flex-to-board connectors enable flexible and high-density interconnects between printed circuit boards (PCBs), LCDs, and various electronic components. As a result, they are increasingly adopted in automotive, smartphones, tablets, laptop PCs, wearables, robotics, and medical ...

In addressing the specific needs of outdoor lighting applications, Amphenol introduces the FLA Series ANSI C 136.10/41 NEMA Receptacles & Caps and the FLB Series ANSI C 136.10/41 NEMA Bases & Domes. Engineered for ruggedness and durability, these connectors meet stringent industry standards, providing reliable connectivity in harsh outdoor environments.

Taiwan – Amphenol ICC, the global leader in connector technology, design and manufacturing, is pleased to announce the release of its IP68 USB4 ™ Gen 3 Type-C ® connector. It has high speed data transmission of up to 40Gbps, power delivery of 100W, compatibility with the Thunderbolt 4 interface that combines power charging, tunneling USB, PCIe data transfer, DisplayPort video and audio ...

While SFP and QSFP OverPass ™ assemblies enable 28G and 56G hardware system designs, QSFP DD and OSFP OverPass ™ assemblies create an eight-channel direct lower loss interconnection enabling 56G and 112G hardware system designs and technology for future 224G systems. These cable assemblies eliminate the need for re-timers and expensive low ...

Amphenol ICC launched the new Cross-Mate™ 2.00mm to mark the beginning of 2020 in January. These wire-to-board connectors offer a compact design and can be used in various applications in consumer, industrial, medical and automotive fields.

The data and communication industry is under constant development to introduce many innovative technologies that makes our lives hassle free. From a simple activity like sending an instant message to advanced operations combining AI and machine-to-machine communication, the performance of all smart devices we handle each day is based on data transfer among these operations.

From low to medium, high to ultra-high-speed, Amphenol ICC offers a versatile range of backplane connectors that suit almost all applications.

The contact pin’s shape, design and retentions are indeed among the key considerations for choosing a connector. Let us discuss about some of the most common and cost-effective pin retention designs that affect the performance of any connector.

System designers are encountering new architectural challenges as single lane data rates are continuing to increase. Next generation SerDes devices d, will soon be scaling to 112Gbps PAM4. A major obstacle in system design is the challenge of passing 112Gb/s high frequency signals through PCB withou

From 56G to 112G to 224G, the connector industry strives to meet the challenges put forth by new technologies every day. Check out Amphenol’s high bandwidth connectors to learn more.