Search Results for pcie gen5

PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch

PCIe Gen3 and 10GbE signal speed capability; MIL-HD2 Next-Gen SOSA/VITA 91 aligned connectors; Open access design and carrying handle; VITA 66 and 67 apertures for optical and RF I/O; Adjustable speed high cfm fans; Rear transition modules slots; Integrated AC/DC power supply; Benefits. Allows testing of air or conduction cooled modules

PCI Express® GEN 4 Card Edge, Storage and Server Connector, Straddle-Mount, x4, 64 Positions, 1.00mm (0.039in) Pitch

Amphenol’s Rugged PCI-Express 1.0/2.0/3.0 fiber optic conversion active assembly provides systems integrators great flexibility as PCI-Express can now be extended over fiber optics in rugged systems. The current product supports a x8 PCI-Express interface on each end of the active cable along with rugged D38999 series 3 receptacles with ...

The MEG-Array ® Mezzanine Connector system provides the high density and high-speed benefits of sa large array supported by the reliability and low costs of standard surface mount PCB assembly.

VHDCI - SCSI Cables (SCSI-5 Cables) from Amphenol Cables on Demand -- The SCSI Leader in Business Computing Applications. Amphenol's VHDCI (Very High Density Cable Interconnect) SCSI cable designs have been selected as the interconnect of choice among the leaders in business computing.

Supports 56 Gb/s PAM4, PCIe ® Gen 5; Delivers superior performance and an upgrade path to future system designs; Optimized for differential pair signaling; High density, compact footprint that is also configurable for open pin field applications; High-density, compact footprint; 12 to 80 differential pair modules; 36 to 240 conductors

EXAMAX2® 112Gb/s High Speed Backplane Connector 85Ω, 4-Pair, 8 column, 112 position, Vertical Receptacle, No Guide Pin.

Amphenol's NeXLev ® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications.

China - Beijing Amphenol Webok Times CenterBlock C, Room 609, Zhongguancun South Street No. 17, Haidian District, Beijing, PRC, 100081 Tel. :+86 10-58797827

These connectors come with a 3.50mm stack height and 30 positions extendable from 10 up to 60 positions and meet PCIe ® Gen 3 standards with speed performance of up to 8Gb/s. Automotive Ethernet Connectors

PCIE Gen 5 connetcors (1) PCIe 6.0 (1) PCIe Card Edge Connectors (1) PCIe DirectAttached (1) PCIe Gen 4 & Gen 5 CEM connectors (1) PCIe Gen 5 CEM Connector (1) PCIe Gen 5 CEM Connectors (1) PCIe M.2 Gen 5 Connectors (1) PIC-SIG (1) PSAS Gen 5 (1) PV (1) Paladin HD2 (1) Pin-in-Paste Termination (1) Power over Ethernet (1) PowerStak (1) Product ...

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4C+ EP receptacle supports X16 PCIe ® lanes, sideband and 200W power; 108-pin receptacle supporting an additional sixteen (16) Tx and Rx PCIe ® lanes; 2 pins power receptacle support up to an additional 400W; Supports different board-to-board/cable module applications like SSD, NIC, CXL; Support XPU/CXL/Smart NIC application and power module

The ExaMEZZ^® connector system is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling.

Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.

The UltraPortTM QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense co

U.3 SAS PCIe 4.0, Plug, Right Angle Surface Mount. Environmental Compliance. Click to download Certificate of Compliance Report. Drawing; 3D Model (STP) Product Specification; Datasheet; PRODUCT AND PRICE. PRODUCT & PRICE Distributor. Distributor Stock Check. Symbol, Footprint & 3D. Symbol, Footprint & 3D. Related Parts ...

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS . FCI Basics BergStak ® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.. Housing and terminal profile guarantees support of up to 12Gb/s . Vertical versus vertical mating configuration

Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market including Automotive, Broadband Communications, Commercial Aerospace, Defense, Industrial, Information Technology and Data Communications, Mobile Devices and Mobile Networks.