Search Results for pcie

PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch

( PCIe) Base Specification. The primary focus is the . implementation of internal and external Small Form Factor PCIe connectors and cables optimized for the client and mobile market segments.

OCuLink is a kind of high density interconnect system which support PCIe and SAS protocol. It can support 8GT/s PCIe signal or 24Gbps SAS signal transmission.

Leading Contributor to OCP Power Applications Launches Busbar Connectors Performing to OCP ORv3 Specifications. Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today, the release of its BarKlip ® BK500 IO and BarKlip ® BK150 IO busbar connectors. These high-current connectors are fully compliant with OCP ORv3 power output and IT gear specifications supporting ...

Amphenol has developed LP SlimSAS solution to support PCIe Gen4 and PCIe Gen5 application, which is also used in application of UPI1.0, SAS4.0 .

Amphenol is one of the leading manufacturers of Connectors. Contact us today for more details, part number 10131758-0052LF

CDFP Cable Assembly, Passive, 28AWG, 1M, PCIe Gen5, Flex Sleeve

PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS . FCI Basics BergStak ® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.. Housing and terminal profile guarantees support of up to 12Gb/s . Vertical versus vertical mating configuration

PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch

PCIe Gen 4 x16 vertical PTH Card Edge Connector, 164 Positions, 1mm (0.039inch) Pitch, 30μin Gold on Contact Area

Engineers can design faster with free E-CAD and M-CAD models for Amphenol Communication Solutions (ACS) connectors available on the Amphenol San Francisco, CA – (September 27, 2022) - Amphenol Communication Solutions, a world leader in interconnect solutions. and SnapEDA, the first search engine for electronic design, are releasing over 21,000 new digital models to help designers bring their ...

XCede^® HD plus leverages the same core technologies as standard XCede^® series. Providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical.

OCuLink is a kind of high density interconnect system which support PCIe and SAS protocol. It can support 8GT/s PCIe signal or 24Gbps SAS signal transmission.

Multi-Trak 8X+power, PCIe Gen5. Environmental Compliance. Click to download Certificate of Compliance Report. EU RoHS: Compliant with Exemption 6(a)-I, 6(b)-II and 6(c) China RoHS: Compliant with Exemption 7.1, 7.2 and 7.3. Low Halogen: Yes. REACH/SVHC: Compliant

FEATURES BENEFITS; Capable of supporting data rates of 25Gb/s with scalable migration path to 56Gb/s; Meets Industry specifications such as Optical Internetworking Forum (OIC), PCI Express, SATA, Fiber Channel, Infiniband, Ethernet, SAS, IBTA and IEEE

Amphenol offers a broad range of memory sockets that perform to JEDEC industry standards. From DDR3, DDR4 to DDR5, Amphenol provides high density, high speed, low operating voltage DDR SO-DIMM, DIMM and SMT sockets to support the developments in DDR.

PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch

Amphenol's FCI Basics Bergstak ® board-to-board product family is one of the most popular board-to-board connector series in the market. Designed for industrial, telecom, datacom, automotive, and medical applications - Bergstak ® offers micro pitch from 0.4mm to 0.8mm, connector position options from 10 to 200, and stack height flexibility from 3mm to 20mm.

SAS/PCIe 4.0 U.2 connector, Vertical Receptacle, Wide base