Search Results for pip values
NovaSensor Medium and High Pressure MEMS Pressure Sensor Die
NovaSensor Medium and High Pressure MEMS Pressure Sensor Die
Amphenol Corporation - News & Events - Events
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G17DC15023313HR | SLIM TYPE DSUB | Amphenol
Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole ...
10137391-100LF | Boltrack™ | Amphenol
Amphenol is one of the leading manufacturers of boltrack connector. Contact us today for more details of boltrack , part number 10137391-100LF.
PV Product Presentation - Amphenol CS
Value Proposition • PV ® is the high performance, highly reliable Wire-to-Board; Wire -to-Wire and Board- to-Board system on 2.54mm pitch for shock and vibration applications • Built around a dual metal contact system with three different spring pressures, PV ® can be customized to meet specific insertion, withdrawal and normal force ...
6 dBd HD omni antenna 380 - 430 MHz, Low PIM - AMPHENOL PROCOM
Peak Instantaneous Power (PIP) 25 kW 3 dB Beamwidth, E-Plane 16° ±1° 3 dB Beamwidth, H-Plane Omnidirectional Impedance 50 Ω Gain 6 dBd (8.2 dBi) VSWR < 1.5:1 Passive Intermodulation-153 dBc (3rd Order, 2 x Tx @ 43 dBm) (PIM value not guaranteed for N connector version) Lightning Protection Lightning current handling capability :
MCX Connectors - Amphenol RF
Amphenol RF offers a broad range of radio frequency MCX Connectors including industry standard designs and highly engineered Amphenol RF proprietary interfaces. Check product specs & datasheets for a wide selection of MCX Connectors at Amphenol RF online.
10135750-101LF | OCTIS™ | Amphenol
OCTIS™ -Input Output Connector,Right Angle Board Connector for 8 position signal PIP termination. Part Specification Detail. Part Specification Detail. The information below is for reference only. For more technical details, refer to product specification and application specification.
Omni Antennas 422x.09-405-Txx - amphenolprocom.com
Peak Instantaneous Power (PIP) ... Quoted performance parameters are provided to offer typical, peak or range values only and may vary as a result of normal testing, manufacturing and operational conditions. Extreme operational conditions and/or stress on structural supports is beyond our control. Such conditions may result in damage to this ...
10137559-101LF | OCTIS™ | Amphenol
10139481-101LF. OCTIS™ - Power, Input Output Connectors, Octis field terminable plug kit with 4 pos 20 Amps Power 26mm pitch
FloatCombo™ 0.50mm Floating Board-to-Board Connectors with Power Pin
Parallel, SMT+PIP Configurations Parallel, SMT+PIP Durability 1 OWdes Durability 100cydes Durability 100(ð'des Durability 100cydes Durability 100(ð'des Durability 1 OWdes Durability 100cydes Durability IOWdes Receptacle Pitch 0.5mm Pin count (20 - 140)" Dielectric vol & withstanding voltage Signal 250V, Power 600V
CD44S13E4RX09LF | D-Subminiature High Density | Amphenol
Product Specification - Compact-D R/A PiP - GS-12-607; Product Presentation; D Sub Brochure; Datasheet - D Sub High Density; PRODUCT AND PRICE. PRODUCT & PRICE Distributor. Distributor Stock Check. Symbol, Footprint & 3D. Symbol, Footprint & 3D. Related Parts. Related Parts. Mating Part. 10090769-P444ALF. D-Sub High Density Board Mount ...
Model 130E20 | PCB Piezotronics
Model 130E20:ICP® microphone with integral preamplifier, BNC jack connector
10137391-101PLF | Boltrack™ | Amphenol
Amphenol is one of the leading manufacturers of boltrack connector. Contact us today for more details of boltrack , part number 10137391-101PLF.
10137559-102LF | OCTIS™ | Amphenol
10139481-102LF. OCTIS™ - Power, Input Output Connectors, Octis plug kit with 3 pos Power upto 20 Amps per position 26mm pitch
Model 003C50 | PCB Piezotronics
Model 003C50:Low-noise coaxial cable, blue PTFE jacket, 50-ft, 10-32 coaxial plug to BNC plug
Model 356A06 | PCB Piezotronics
Model 356A06:Triaxial, lightweight (1.0 gm) miniature, adhesive mount, ceramic shear ICP® accel., 5 mV/g, 0.25" cube, mini 8-36 4-pin connector
BABAA - amphenol-ns.com
BABA Compliance and Amphenol Network Solutions. On February 23, 2024, the United States Department of Commerce issued a limited, general applicability, nonavailability waiver of the BABA preference requirements for the BEAD Program for certain construction materials and certain manufactured products.
D-Sub Product Presentation - Amphenol CS
Pin-in-Paste technology (PiP) allows the use of Through Hole product in SMT manufacturing processes. The connectors are automatically or manually placed on the board, and then soldered in the same operation as the SMT components Same PCB layouts and hole diameters of signal hole contacts are maintained
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