Search Results for psas
Connecting with the Autonomous Vehicle - Amphenol CS
The global automotive industry is passing through massive transitions each day. Driving is much more to consumers than a means of mobility. From high-speed data connectivity and infotainment to person-identification sensors and autonomous driving, the smart cars of today have a handful of features to offer.
Next Generation Infotainment for Smart Vehicles - Amphenol CS
Apart from these, we offer a wide range of board-to-board and wire-to-board connectors that support various components of automotive infotainment, among which Minitek MicroSpace ™ Crimp-to-Wire connector is a great choice. Their unique design enables LV214 Severity-2 automotive standard and comes in 1.8, 1.5 and 1.27mm pitch.
What are the top differences between DDR4 and DDR5? - Amphenol CS
Data and its associated storage are fundamental to any computing application, ranging from notebooks and laptops to sophisticated servers and data centers.
Power Solutions for EV Charging Stations - Amphenol CS
Amphenol Power Solutions offer the largest range of connectors for power distribution in the market capable of supporting various application requirements from 10A to 1000A+.
Wi-Fi 7: Wireless Revolution - Amphenol CS
2024 is touted to see the release of the latest Wi-Fi standard, the 802.11be or Wi-Fi 7. It aims to deliver extremely high throughput (EHT). The latest addition is set to revolutionize wireless transmission with its 4.8x faster speed than Wi-Fi 6, better efficiency, deterministic latency, and higher
SPS IPC Drives – Product Highlight – VerIO™ Connector
Experts from the automation industry have gathered at Nuremberg, Germany for Europe’s leading exhibition for electric automation. - SPS IPC Drives 2017.
112G for Quickest Data Transfer - Amphenol CS
Data usage is increasing every year, and the communications industry is working diligently to support the increased demand. This article discusses why we need more data, what data center physical layer architecture changes are needed to support higher data rates, and how Amphenol is well positioned to support higher data rate systems.
Growth and Trends of Solid State Drives (SSDs) - Amphenol CS
The SSD market is expected to take a giant leap in 2020 with the increased demand for cloud applications and the improvement in technology like 5G connectivity. Amphenol offers a wide range of solutions to support different types of SSD.
Connector Trends in Advanced Automobiles - Amphenol CS
In addition to the above-mentioned automotive connectors, we offer high-speed flex connectors in various pitch sizes, waterproof USB connectors, advanced Type C Gen 3 USB connectors, and memory and media connectors like the 2.70mm ultra-thin Micro SD and SD card sockets .
Choosing The Right Connectors For PCB - Amphenol CS
A small connector footprint makes the PCB design less complicated along with reducing the cost. This also reduces the transmission losses while making a connection from one point to another.
Accelerating Network Speeds with 400G - amphenol-cs.com
From the present era of 100 to 200G per second speeds, the networking industry is ready to witness a dramatic leap into 400G. The bandwidth demands in data centers, edge computing and cloud computing are constantly increasing the traffic in cyberspace, which is leading to the quick deployment of 400G.
Amphenol's Solutions for OCP Rack and Power
Open Compute Project, also known as OCP, is a community focused on redesigning hardware technology for hyper-scale data centers, telecom & colocation providers, enterprise IT users, and many more markets.
FlexLock® for Simplifying Battery Management System Designs - Amphenol CS
Amphenol as a leader in the interconnect industry always looks forward to bringing technological developments in a sustainable way. This is one of the major reasons why we develop advanced interconnect solutions that support various components within electric vehicles.
Addressing High-Speeds with ExaMAX® - amphenol-cs.com
The need for high-speed connectivity is more pronounced than ever in this era of the Internet and interconnected systems. Cables and connector solutions have evolved to perform better than ever to support fast-paced information networks.
Amphenol 2021 in Retrospect
With the advent of 5G, the world gets smarter in all its forms. Hence Amphenol has developed the right blend of high-speed, power-efficient, rugged connectors crafted for the Internet of Things, from smart homes to Industry 4.0, covering key sectors like transportation, medical, health care, energy management, and military.
Come Visit Amphenol at OCP Global Summit 2022
Amphenol is excited to exhibit at the 2022 OCP Global Summit, the largest gathering of key decision-makers, executives, engineers, developers, and suppliers who support open source and open collaboration in hardware and software.. The theme for this year is “Empowering Open”. From hyperscalers to enterprises and government, today everyone is looking at open collaboration from researching ...
Seamless Connectivity with New Minitek® TPA Connectors
Amphenol is introducing its new Minitek® TPA connectors, which is enhanced with Terminal Position Assurance (TPA) features, making it a great choice for consumer applications, that require electrical continuity and safeguards against any issues caused by improper assembly.
Hyperscale Computing: Innovation for Data Centers
Hyperscale computing refers to the facilities required in distributed computing environments to efficiently scale from a few severs to thousands, and is commonly used in environments such as Big Data and Cloud Computing.
Tag Archives: DAC cables - Amphenol CS
It is a proud moment for Amphenol ICC as we have been awarded the Product of the Year Award in the “Interconnects” category of Electronic Products magazine.
The Amphenol Solutions for Programmable Logic Controllers
With rapid developments in industrial automation, PLC or Programmable Logic Controllers are being an essential part of any manufacturing environment. A PLC generally has a PLC Rack, Interface Module, Communication Module, CPU Module and a Power Supply Module.