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CompactPCI ® is a highly successful architecture since its formation in the 1990s. This offers ruggedized, Eurocard-based form factor around Intel’s PCI architecture. These were basically used in telecom and datacom applications and later CPCI became a top choice for air and conduction-cooled implementations in military applications.

Smart Grids establish electricity networks that enabled two-way supply and communication. Here, not only would the energy from substations reach the consumers, but also would be fed back to the grid from rooftop solar panels, and the net consumption data are duly send back to the utility for billing

HVAC stands for heating, ventilating and air conditioning systems. Various HVAC systems are used for air conditioning homes to large industrial complexes, shopping malls, and apartment blocks.

Data usage is increasing every year, and the communications industry is working diligently to support the increased demand. This article discusses why we need more data, what data center physical layer architecture changes are needed to support higher data rates, and how Amphenol is well positioned to support higher data rate systems.

The Data and Communication industry witnesses lightning developments every second. Technological innovations have become a norm in the present era and the computing industry further stands out with massive developments that again become the basis for many other swift changes.

ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124) is now added to the list of CC-Link IE TSN Specifications Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today that the CC-Link IE TSN Specification List for March 2023 will now include ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124).

The changing trends in technology are demanding applications that can withstand a harsh environment that involves exposure to dust, splashing water or cleaning solutions over the course of their lifetime.

Amphenol is making its presence felt in the world of Artificial Intelligence and Machine Learning as it gets ready for the AI Hardware & Edge AI Summit 2024. It’s set to be a landmark event in the AI and machine learning (ML) calendar.

Amphenol’s latest addition to its list of interconnect solutions with best-in-class mechanical and signal integrity performance is the DensiStak ™ Board-to-Board Connector.This connector is a solution that addresses the need for flexible pin design, high-density and compact interconnects, especially in challenging environments like automotive applications.

Amphenol ICC has a broad array of innovative technology and solutions to support Industry 4.0 and the Automotive industry. Come see the star products in our Industrial and Automotive showcase:

2021 OCP Global Summit will be a hybrid event, the in person event will be on November 9-10, 2021 at the San Jose Convention Center and all in-person content will be live-streamed to our online platform. You can register for both in person and virtual access for the event.

In this blog, we’ll break down and understand OSFP connectors, their features, benefits, and specifications. What is an OSFP? Octal Small Form-factor Pluggable (OSFP) is a pluggable form factor developed by the OSFP MSA group, which was launched by Google and led by Arista Networks.

The Open Compute Project (OCP) Global Summit is set to be a pivotal event for Amphenol, a leading global interconnect solutions provider. From October 17 th to 19 th, Amphenol will be at the San Jose Convention Center, unveiling an array of innovative products designed to revolutionize the world of data center connectivity.. Unveiling Next-Generation Solutions

Industry 4.0 and IIoT (Industrial Internet of Things) is enabling a shift from a hierarchical factory and process automation control model to a decentralized, fully IP addressable network like the Cloud to the factory floor.

With the advent of 5G, the world gets smarter in all its forms. Hence Amphenol has developed the right blend of high-speed, power-efficient, rugged connectors crafted for the Internet of Things, from smart homes to Industry 4.0, covering key sectors like transportation, medical, health care, energy management, and military.

The 5G spectrum is enabling a new arena of intelligent infrastructure and a fully connected world. To meet the demanding requirements of modern mobile connectivity, each 5G component is redefined with enhanced performance, flexibility, scalability, and efficiency. We have discussed in our previous articles how Amphenol supports the strategic changes put forth by the fifth generation of ...

From low to medium, high to ultra-high-speed, Amphenol ICC offers a versatile range of backplane connectors that suit almost all applications.

Experts from the automation industry have gathered at Nuremberg, Germany for Europe’s leading exhibition for electric automation. - SPS IPC Drives 2017.

The introduction of 224G PAM4 technology plays a pivotal role in the evolution of data center connectivity. With unprecedented speed, enhanced bandwidth, and robust system architecture, this Gigabit Ethernet solution is set to redefine the capabilities of data centers, enabling them to keep pace with the rapidly advancing landscape of AI and data-intensive applications.

Enterprise Server Solution Providers Launches EDSFF, OCP, Power Shelf and PCIe ® DirectAttached ® Cable Solutions. Singapore, March 4, 2023 – Amphenol Communications Solutions is pleased to announce today, the release of its high-speed cable solutions with options to meet PCIe ®, EDSFF, OCP specifications, and power shelf requirements. In close collaboration with the PCI-SIG association ...