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Amphenol contributes high-performance interconnects for OCP-specified server components, including acceleration modules, system security, and control modules, and I/O board NICs.

In this blog, we delve into the remarkable features, benefits, and significance of ExaMAX2®, the next-generation connector system that promises to redefine the standards of data transmission.

The Amphenol EDSFF E1/E3 High-Speed Interconnect is a new addition to the CXL solutions. It is designed to optimize performance in CXL-enabled systems and features a compact form factor.

Mini Cool Edge IO provides not only a SI performance ready signal transmission medium but also a new way of system design thinking that will lead your electronic system to a completely cost-effective, highly modularized, and extremely easy-to-repair system.

Amphenol offers the most comprehensive backplane connector and cable portfolio in the industry. With supporting speeds up to a staggering 224G and compatibility with PCIe ® Gen7, these innovative interconnects redefine the benchmarks of connectivity. Designed to excel in all high-speed applications, these connectors and cables optimize space utilization without compromising performance along ...

2018 marks the 20th anniversary of one of the most widely accepted and influential power connectors in the industry today, the PwrBlade ® power connector. From its initial release, PwrBlade ® was considered a game-changer for its high performance stamped and formed contacts. Since then, the PwrBlade ® family has served as the de-facto standard in data centers and has expanded over 3 ...

PCIe ® 6.0 Specififcations. Now PCI-SIG has announced its sixth generation, the PCIe ® 6.0, which is targeted to be released by 2021 and is designed to meet the evolving trends including Artificial Intelligence and Big Data. The new standards will be introduced with double the data rates i.e, it will take a leap to 64GT/s from the 32GT/s of PCIe ® 5.0.The earlier generation was following ...

Board to Board Connector. Board-to-board connectors connect signals between two printed circuit boards (PCBs) without a cable. At Amphenol, we offer a variety of board-to-board options to fit your specific needs and design these connectors to provide you with the best performance for each application.

The PCIe ® Gen 5 Flip CEM is a newly introduced vertical card edge connector that adheres to the PCIe ® standard mating interface. Its unique design features "JJ" or "LL" type contacts, resulting in a significant reduction of up to 19.5% in the keep-out area compared to traditional CEM connectors. Amphenol’s Flip CEM connectors can support bandwidths up to 32GT/s (Gen5) and can mate with ...

The FLB series cover couples with the base to provide IP66 protection (per IEC 60529) for the mated photocell/control assembly. Domes are available in Grey, Clear, Red, Black, White and Translucent colors in 35mm, 50mm, 60mm, 75mm, 100mm & 130mm heights. The mating gaskets and O-rings on the bases ensure IP66 rating performance to protect equipment from moisture ingress.

Batteries are the lifeline of any electric vehicle. Lithium-ion cell packs predominantly store energy in EVs, large battery-based unmanned aerial vehicles like drones, and portable devices that require reliable, compact, and high power sources.

The instruments used to test various parameters defining the flawless performance of an application or gears are commonly termed as test and measurement equipment.

Amphenol currently participates in over 70 unique activities – including full-scale standards, consortiums, multi-source agreements (MSAs), trade associations, and ad-hoc or sub-committee meetings.

FlexLock™ is compliant with USCAR-T2V2 and LV-214 S3 specs, with 2A per contact for high power. It has 2 pitch options, standard on 2.54mm and 3.20mm for larger creepage and clearance distances. FlexLock™ is built around a reliable dual beam contact system for excellent electrical performance and offers an active latch and Connector Positioning Assurance (CPA) to ensure a reliable ...

Plug-and-Play Qi2 module to be available later this year. Shanghai, China and Chicago, IL – April 24, 2023 – Shanghai Amphenol Airwave Communication Electronics Co., Ltd, an operation within Amphenol Corporation (NYSE: APH) is bringing on NuCurrent, the global authority in wireless power systems, as a strategic IP partner.This partnership will address the urgent, industry-wide need for ...

Battery Storage System is at the heart of the ESS. Amphenol has Busbar connectors and cables as well as Input Output solutions going into 48V / 1000V / 1500V Lithium ion battery racks. Our BarKlip ® connectors offer the smallest 150A+ ESS solution in the market with a high current rating of up to 160A /200 /300A per contact @ 30°C T-Rise. With a wire range of 8AWG-0AWG, these connectors ...

Amphenol Ardent Concepts is dedicated to leading the way in interconnectivity solutions within unique and challenging environments, including on your display.

Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip and delivers a direct link to the external port when compared ...

Amphenol is proud to announce that Yifan Huang and Stephen Smith will present a technical paper titled “PCIe Gen 5 CEM Connector and Add-In Card PCB design optimizations” at DesignCon 2019.

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.