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Amphenol ICC offers a wide range of harsh environment connectors for multiple industries and applications.

In this blog, we delve into the remarkable features, benefits, and significance of ExaMAX2®, the next-generation connector system that promises to redefine the standards of data transmission.

Amphenol currently participates in over 70 unique activities – including full-scale standards, consortiums, multi-source agreements (MSAs), trade associations, and ad-hoc or sub-committee meetings.

The PCIe ® Gen 5 Flip CEM is a newly introduced vertical card edge connector that adheres to the PCIe ® standard mating interface. Its unique design features "JJ" or "LL" type contacts, resulting in a significant reduction of up to 19.5% in the keep-out area compared to traditional CEM connectors. Amphenol’s Flip CEM connectors can support bandwidths up to 32GT/s (Gen5) and can mate with ...

Miniature connectors are one of the most significant parts of any smart device. The case of smart automobiles is not different as well. We have already discussed on smart solutions for automotive in many previous articles. Amphenol’s Minitek MicroSpace ™ Crimp-to-Wire connector offers a unique design that enables LV214 Severity-2 and performs at 1.8, 1.5, and 1.27mm pitch and is designed ...

As the electric vehicle market continues to grow, the importance of the battery pack and its component parts cannot be overstated. At the heart of the battery pack is the cell connection system (CCS), which plays a critical role in ensuring the reliable performance and longevity of the battery.

Industrial robotic arms painting automotive, picking and placing orders at warehouses and helping assemble minute and fragile parts at manufacturing factories with precision is no more a fiction.

Amphenol’s new M.2 Gen 5 connectors are much more advanced than their predecessors and can meet PCI Express® 5.0 specifications. Supporting higher data rates up to 32Gb/s and occupy lesser board space compared to the PCIe® Mini Card connector, they are capable of supporting multiple add-in cards lik

Amphenol has teamed with Xtalic Corporation to build high-performance and high-reliability connectors that are the pipeline for the internet. These connectors demand the highest reliability and utilize gold to help meet these requirements.

Earlier in 2019, PCIe® introduced its latest version, PCIe® 5.0, with 32GT/s transfer rate and 30Gb/s throughput per lane. It also has improved signal integrity and is backward-compatible with CEM connectors for add-in cards.

PCIe ® 6.0 Specififcations. Now PCI-SIG has announced its sixth generation, the PCIe ® 6.0, which is targeted to be released by 2021 and is designed to meet the evolving trends including Artificial Intelligence and Big Data. The new standards will be introduced with double the data rates i.e, it will take a leap to 64GT/s from the 32GT/s of PCIe ® 5.0.The earlier generation was following ...

25% Increase in Current Density Compared to Existing Card Edge Designs! The NEW 3000W EnergyEdge ™ X-treme Card Edge series offers the highest linear density available in the market today. X-treme’s revolutionary dual contact design pushes the boundaries of card edge technology beyond 3000W to power modern system architectures.

DDR- SDRAM stands for Double Data Rate - Synchronous Dynamic Random Access Memory and it is a common type of memory used-organized RAM in most of the processors.

The popularity of eco-friendly transportation increases every day, and E-bikes come out as one of the most prevalent choices. Although these were earlier mainly considered for mountaineering or sporting, at present these are being adapted as a regular mode of commute in many places.

Amphenol ICC Cool Edge product family is a hybrid card edge solution, used in data centers and servers. Hybrid connectors are effective solutions serving both power and signal requirements as they contain both power and signal contacts.

DIN 41612 is a comprehensive backplane offering from Amphenol ICC with a legacy of nearly five decades.With a broad range of DIN 41612 styles; these connectors has an edge over other backplane connector solutions in terms of mass deployment specifically in Industrial and Instrumentation sectors.

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.

Visit Amphenol in Hall 10 at booth 210 from November 14th to November 16th, 2023, in Nuremberg, Germany for SPS 2023.

The global automotive industry is passing through massive transitions each day. Driving is much more to consumers than a means of mobility. From high-speed data connectivity and infotainment to person-identification sensors and autonomous driving, the smart cars of today have a handful of features to offer.

In the ever-evolving landscape of robotics, the heartbeat of these autonomous systems lies within their power source – the battery. Much like in electric vehicles, the Battery Management System (BMS) emerges as a critical player, ensuring the efficient utilization of energy and the safeguarding of batteries against potential hazards.