Search Results for psas

Automotive World is a leading global exhibition in automotive electronics, covering technologies like connected cars, autonomous driving, EV/HV/FCV, and MaaS. This year, 2023, the event will be held at Tokyo, Japan. Both Automotive OEMs and Tier 1 suppliers are among the 1,420 exhibitors, 70K visitors, and 170 speakers expected to attend the event.

As the computer industry grows, data centers are going through a constant evolution to meet the increasing data management demand. Data centers have to change to accommodate the new designs, increased complexity, higher speeds, and higher densities.

Millipacs Backplane Connectors. Compliant with IEC 917, IEC 61076-4-101 industry standards, and offering a 2.00 mm grid interconnection system, Millipacs ® is ideal for rugged environments. With features like two-beam twisted tulip contacts, EMI shielding, coding, guiding, and high operating temperature capabilities, these connectors excel in demanding medical-surgical applications, serving ...

Memory standards have always been a factor determining the performance of a system. Over time, it has gone through constant updates from SDR, or Single Data Rate RAM to the recent DDR or Double Data Rate.

OFC is the most comprehensive and largest conference and exhibition for optical communications and networking. It is the go-to place to visit and interact with hundreds of manufacturers on their latest products and innovative solutions and to understand on the trends that drive the market.

In the fast-paced world of modern electronics, the demand for compact and lightweight devices continues to soar. Flex-to-board connectors enable flexible and high-density interconnects between printed circuit boards (PCBs), LCDs, and various electronic components. As a result, they are increasingly adopted in automotive, smartphones, tablets, laptop PCs, wearables, robotics, and medical ...

ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124) is now added to the list of CC-Link IE TSN Specifications Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today that the CC-Link IE TSN Specification List for March 2023 will now include ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124).

The 5G spectrum is enabling a new arena of intelligent infrastructure and a fully connected world. To meet the demanding requirements of modern mobile connectivity, each 5G component is redefined with enhanced performance, flexibility, scalability, and efficiency. We have discussed in our previous articles how Amphenol supports the strategic changes put forth by the fifth generation of ...

Hyperscale computing refers to the facilities required in distributed computing environments to efficiently scale from a few severs to thousands, and is commonly used in environments such as Big Data and Cloud Computing.

Amphenol is gearing up for the 2nd NEPCON Japan event taking place from September 13 to September 15, 2023, in Chiba.From Industrial 4.0 to E-mobility, Consumer electronics to Data Centers, 5G to Medical devices, and Energy Storage systems, Amphenol's array of cutting-edge connectors will be on display at booth No. 7 -9 at their venue in Makuhari Messe, Japan.

BergStak ® 0.80mm board-to-board connectors are an essential part of medical monitoring equipment, helping to realize space-saving and high-speed board-to-board connections between main boards and add-on boards. Featuring optional shielding to minimize EMI and meets the increasing trend to use BergStak on FPC cables for flexible connections to solve medical board design challenges.

DesignCon, the largest event for Chip, Board, and Systems Design Engineers, brings together the brightest talents across the world. This premier gathering has the legacy of more than two decades in solving the signal and power integrity challenges and creating innovative design solutions for tomorrow.

Visit Amphenol in Hall 10 at booth 210 from November 14th to November 16th, 2023, in Nuremberg, Germany for SPS 2023.

Come visit us at Booth No. 11, Yokohama, Japan from 9th through 10th November 2022 at IEEE SA Ethernet & IP @ Automotive Technology Day to learn more about Amphenol’s advanced offerings

Amphenol is gearing up to showcase its high-performance AI product offerings and demonstrate the vital role of connectivity in AI and ML applications at the AI Hardware Summit 2023.

Amphenol’s latest addition to its list of interconnect solutions with best-in-class mechanical and signal integrity performance is the DensiStak ™ Board-to-Board Connector.This connector is a solution that addresses the need for flexible pin design, high-density and compact interconnects, especially in challenging environments like automotive applications.

Power supply is a device that converts electric current from a main power source like grid, generators or batteries to electric power required for a load or end device such as a motor or other electronic device

Minitek ® and BergStak ®. Amphenol's Minitek ® and BergStak ® series provide modular board-to-board connectors suitable for a wide range of applications, including medical wearables. These connectors offer various pitch options and stack heights, allowing flexible design configurations. With high-speed data transmission capabilities and reliable connectivity, they can benefit from portable ...

The future of technology is focused on energy efficiency and sustainability. The approach lies in environmentally friendly battery-powered solutions. The innovation of e-bikes, electric forklifts, and Energy Storage Systems is a significant step toward this future. Amphenol is at the forefront of th

Wallingford, Connecticut, September 21, 2021. Amphenol Corporation today announced it was the recipient of two Cisco awards: Cisco 2021 GSM Supplier of the Year and Cisco 2021 Supply Chain Operations Supplier of the Year. Cisco unveiled the award winners at its annual Supplier Appreciation Event (S