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Throughout 2023, we actively participated in various events. Some of them include Smart Production Solutions, Open Compute Project US Summit, European Conference on Optical Communications, electronica India, 2nd Nepcon Japan, AI Hardware Summit, and many more.

BergStak ® 0.80mm board-to-board connectors are an essential part of medical monitoring equipment, helping to realize space-saving and high-speed board-to-board connections between main boards and add-on boards. Featuring optional shielding to minimize EMI and meets the increasing trend to use BergStak on FPC cables for flexible connections to solve medical board design challenges.

Introduction. In an era where data speeds define technological progress, Amphenol's latest innovation, the PCI Express ® DirectAttached ® CEM Card Edge Connectors, emerges as a game-changer.Engineered with cutting-edge technology, these connectors are set to revolutionize the landscape of data transmission, offering unparalleled performance and flexibility.

Amphenol Ardent Concepts is dedicated to leading the way in interconnectivity solutions within unique and challenging environments, including on your display.

The convergence and virtualization trends of modern Data Center storage are extending their scope to meet next generation requirements. The article gives a brief on modern practices and future technologies that will meet the demands of advanced Data Center storage. Modern storage architectures

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

Minitek ® and BergStak ®. Amphenol's Minitek ® and BergStak ® series provide modular board-to-board connectors suitable for a wide range of applications, including medical wearables. These connectors offer various pitch options and stack heights, allowing flexible design configurations. With high-speed data transmission capabilities and reliable connectivity, they can benefit from portable ...

Amphenol currently participates in over 70 unique activities – including full-scale standards, consortiums, multi-source agreements (MSAs), trade associations, and ad-hoc or sub-committee meetings.

In addition to the above-mentioned automotive connectors, we offer high-speed flex connectors in various pitch sizes, waterproof USB connectors, advanced Type C Gen 3 USB connectors, and memory and media connectors like the 2.70mm ultra-thin Micro SD and SD card sockets .

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.

A small connector footprint makes the PCB design less complicated along with reducing the cost. This also reduces the transmission losses while making a connection from one point to another.

Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the development of a 112Gb/s interconnect t

Apart from these, we offer a wide range of board-to-board and wire-to-board connectors that support various components of automotive infotainment, among which Minitek MicroSpace ™ Crimp-to-Wire connector is a great choice. Their unique design enables LV214 Severity-2 automotive standard and comes in 1.8, 1.5 and 1.27mm pitch.

Zhaga Consortium is a leader in the lighting industry that defines standards for lighting solutions to meet the trends like smart lighting, and create inter-operable components so that they can be serviced, replaced, or upgraded with improvements in technology.

The changing trends in technology are demanding applications that can withstand a harsh environment that involves exposure to dust, splashing water or cleaning solutions over the course of their lifetime.

Amphenol as a leader in the interconnect industry always looks forward to bringing technological developments in a sustainable way. This is one of the major reasons why we develop advanced interconnect solutions that support various components within electric vehicles.

As another year wraps up, it makes us so proud to look back and see how fabulously we had managed the most challenging of our times. With over 40 new product launches, 8000+ parts created, and with a handful of advanced application solutions, 2021 had been a splendid year for Amphenol.

Millipacs Backplane Connectors. Compliant with IEC 917, IEC 61076-4-101 industry standards, and offering a 2.00 mm grid interconnection system, Millipacs ® is ideal for rugged environments. With features like two-beam twisted tulip contacts, EMI shielding, coding, guiding, and high operating temperature capabilities, these connectors excel in demanding medical-surgical applications, serving ...

Ethernet is serving many modern industrial and commercial applications like smart lighting, intelligent building, IP based security systems, and factory automation with flawless data transfer capacity and current handling capabilities.

Amphenol is gearing up to showcase its high-performance AI product offerings and demonstrate the vital role of connectivity in AI and ML applications at the AI Hardware Summit 2023.