Search Results for radsok

RADSOK® technology is based upon a stamped and formed flat grid, uniquely twisted into a hyperbolic geometry to provide robust, high-density contact to the mating pin contact.Most pin and socket technologies rely upon spring (beam element) properties of the contact elements, which tend to weaken over time. Unlike most other pin and socket solutions, the RADSOK® also utilizes the tensile ...

• RADSOK® Socket and pin / silver over nickel plating • High Temp LCP housing for SMT processing of PCB mount receptacles. ... C10-747781-000 PCB SOLDER SMT LCP, 3,6MM, VERTICAL C10-752155-000 PCB SOLDER SMT LCP, 3,6MM, VERTICAL C10-753787-XXX BLACK, 3.6MM, CRIMP 4,8,12 AWG

∅6mm RADSOK Signal Contacts（信号端子）： ∅3mm RADSOK Terminal technology（连接方式）: Crimping process for termination压接 General: Meet Specifications（设计标准）： GB/T20234-2015 Temperature monitor（温度监控）： NTC10K IP degree（防护等级）： IP54(unmating) IP55(mating)

Amphe-RXS is RADSOK® Mixed with Signal in One System A Battery Solution for Transportation BACKGROUND As the battery market continues its rapid growth with hybridization and electrification, the need for system reliability and lower costs are focal points more than ever before. There are also certain transportation markets, primarily motorcycles

The RADSOK® R8S round contact system, proven over many years, ensures efficient and reliable power transmission. The RADSOK® contact offers very high power density and enables the design of the HV connectors. The POWERSOK® product family is the benchmark in installation space and compactness, and the necessary robustness at the same time ...

RADSOK® technology is based upon a stamped and formed flat grid, uniquely twisted into a hyperbolic geometry to provide robust, high-density contact to the mating pin contact.Most pin and socket technologies rely upon spring (beam element) properties of the contact elements, which tend to weaken over time.

potential failures. RADSOK® Power-to-Board products are designed to be applied manually by press-fit or by a re-flow solder process eliminating the need for additional wires and/or special crimp tools. RADSOK® PowerBlok™ provides a high current single-point connection of up to 70 Amps to the PCB utilizing our custom 3.0mm RADSOK® design ...

RADSOK® technology is based upon a stamped and formed flat grid, uniquely twisted into a hyperbolic geometry to provide robust, high-density contact to the mating pin contact.Most pin and socket technologies rely upon spring (beam element) properties of the contact elements, which tend to weaken over time. Unlike most other pin and socket solutions, the RADSOK® also utilizes the tensile ...

The Amphe-RXS incorporates Amphenol’s RADSOK® technology for higher amperage, lower t-rise, less resistance and lower mating forces. Because RADSOK® allows ~50% more amperage through the same size pin, using them in the Amphe-RXS makes it extremely compact. These power terminals can range in size from 2.4 mm to 5.7 mm (up to 120 A continuous).

our patented RADSOK® technology used globally around the world for many years. The product features higher amperage, lower T-rise, less resistance, lower mating force and higher mating cycles. Because RADSOK® allows 50% more amperage through the same size pin, the UPC is compact; and because it is plastic, it is also lightweight.

RADSOK® technology is based upon a stamped and formed flat grid, uniquely twisted into a hyperbolic geometry to provide robust, high-density contact to the ma

The connector’s RADSOK twisted grid configuration allows for up to 50% more current to pass through the same size pin, while providing increased reliability, cycle durability and lower mating forces. The UPC 14mm also offers a quick lock and release function and a keyway design to prevent incorrect mating. It meets an IP67 rating when mated ...

RADSOK® technology is based upon a stamped and formed flat grid, uniquely twisted into a hyperbolic geometry to provide robust, high-density contact to the mating pin contact.Most pin and socket technologies rely upon spring (beam element) properties of the contact elements, which tend to weaken over time.

radsok pcb | Amphenol Global Search | Amphenol awm-3p | Amphenol Global Search | Amphenol AMPHENOL CORPORATION 40-60 Delaware Avenue, Sidney, NY 13838-1395 • 800-678-0141 • www.amphenol-aerospace.com 16617 MIL-DTL-26482, Series 2, Matrix BAYONET COUPLING CONNECTORS WITH CRIMP REAR RELEASE CONTACTS. ...

The RADSOK® R8S round contact system, proven over many years, ensures efficient and reliable power transmission. The RADSOK® contact offers very high power density and enables the design of the HV connectors. The POWERSOK® product family is the benchmark in installation space and compactness, and the necessary robustness at the same time

RADSOK® technology is based upon a stamped and formed flat grid, uniquely twisted into a hyperbolic geometry to provide robust, high-density contact to the mating pin contact.Most pin and socket technologies rely upon spring (beam element) properties of the contact elements, which tend to weaken over time. Unlike most other pin and socket solutions, the RADSOK® also utilizes the tensile ...

RADSOK® is a technology that uses a stamped and formed flat grid to provide robust, high-density contact to the mating pin contact. It offers low contact engagement/separation forces, low contact resistance, and high mating cycle durability in various industries and applications.

RADSOK® technology is based upon a stamped and formed flat grid, uniquely twisted into a hyperbolic geometry to provide robust, high-density contact to the mating pin contact.Most pin and socket technologies rely upon spring (beam element) properties of the contact elements, which tend to weaken over time.

radsok®基板接続コネクタ. カタログ; 最新の電子機器で使うプリント基板はより多くの電流を必要としますが、そのために基板の銅層を厚くしたり基板を追加するとコストが嵩むため、両者はトレードオフの関係にあります。