Search Results for rjmg-2012

Three high-speed products were introduced to the Amphenol ICC product portfolio in the month of August. Double Density Cool Edge Connectors and BergStak ® FX10 offers high-speed high-density board to board solutions and the microSD Express Connector uses PCI express 4.0 protocol rated up to 16Gb/s making it a high-performance memory card connector compliant to SD specification V7.1

Amphenol is set to make a significant presence felt at the highly anticipated Open Data Center Committee Summit (ODCC) 2023, slated to be held at the Beijing International Convention Center from September 13 to September 14 at booth A06.. The ODCC Summit, a prominent event in China's Data Center landscape, brings together key players in the field.

With the advent of data-hungry technologies, the demand for super-speed, highly reliable storage technologies are also mounting. New standards are being developed and introduced to catch up with these infrastructural changes and data demands.

When it comes to a connector design, engineers are often confused about the choice between IDC and crimped contacts. Both being very reliable and efficient connector systems, it mainly depends upon the end application.

Kaye ValProbe RT CO 2 Logger. The 3-in-1 data logger from the Kaye ValProbe RT product line offers the capability to measure critical parameters such as CO 2 (carbon dioxide), relative humidity (RH), and temperature with a single device. For applications where these measurements are quality-critical, the Kaye ValProbe RT CO 2 Logger provides economical, accurate, and GxP-compliant recording ...

For over three decades, Amphenol BSI has stood at the forefront of the High Tech Backplane Assembly Industry. Their core focus has been on Signal Integrity, Design, Assembly, and Testing of High-Speed Backplane systems, particularly for the global IT Datacom markets.

RJMG, Input output Connectors, 1x1 10/100 with leds

5 05 October 2012 R29090A/00 The introduction of Variation 4. 6 10 March 2015 R70004681A R70004681B The introduction of Variation 5. 7 12 February 2016 R70050289A The introduction of Variation 6. 15 SPECIAL CONDITIONS FOR SAFE USE 15.1 The sensing Head shall be used in conjunction with apparatus providing an intrinsically safe supply ...

Smart wearables is one of the most trending industry today. Amphenol provides an array of miniature, high-performance interconnect solutions for next-generation wearable devices including Board-to-board, wire-to-board, and FFC/FPC connectors.

Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications.

The data and communication industry is under constant development to introduce many innovative technologies that makes our lives hassle free. From a simple activity like sending an instant message to advanced operations combining AI and machine-to-machine communication, the performance of all smart devices we handle each day is based on data transfer among these operations.

Amphenol was proud to exhibit at LightFair, in Las Vegas, Nevada, for the first time. It was an engaging three-day experience that brought together over 320 exhibitors, including lighting design and technology manufacturers, innovators, and professionals from around the globe

RJMG 1x1 10/100, RightAngle

In the ever-evolving landscape of robotics, the heartbeat of these autonomous systems lies within their power source – the battery. Much like in electric vehicles, the Battery Management System (BMS) emerges as a critical player, ensuring the efficient utilization of energy and the safeguarding of batteries against potential hazards.

In October 2019, Amphenol ICC introduced two new products. F323 series was added to our 0.50mm FFC/FPC connector range. HSC connector is the second in the list.

SI-VG-2012-11-013 4x28G QSFP+ Signal Integrity Performance Reports (This applies only to SI-VG-2012-11-021 the 28G P/N) GS-29-622 10G Qualification Test Report Summary EL-2012-05-033 14G Qualification Test Report EL-2012-12-023 28G Qualification Test Report 3.2 INDUSTRY DOCUMENTS FIT, FORM AND FUNCTION

NOTICE - These drawings, specificati ons, or other data (1) are, and rema in the are given by Amphenol Corp. The fur nishing of these drawings, specifica tions, or

Amphenol FCI Basics has introduced 4 new connectors into its array of the board-to-board and crimp-to-wire connector product lines in the month of July. The Minitek ® MicroSpeed connectors are shielded high-speed connectors up to 25Gb/s.

Memory standards have always been a factor determining the performance of a system. Over time, it has gone through constant updates from SDR, or Single Data Rate RAM to the recent DDR or Double Data Rate.

HVAC stands for heating, ventilating and air conditioning systems. Various HVAC systems are used for air conditioning homes to large industrial complexes, shopping malls, and apartment blocks.