Search Results for sfp-dd

BergStak ® 0.80mm Shielded Connectors. Bergstak ® shielded connector with 0.80mm pitch is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. The shielded design of these connectors provides superior EMC performance and significantly reduces coupling inductance leading to excellent electromagnetic compatibility.

Exploring Interconnect Solutions for Next-Generation Immersion-Cooled Data Centers Sep 24, 2024

Amphenol ICC’s BergStak ® family is known for its high speed and high signal integrity in a compact form factor. The portfolio of BergStak ® is now extended with the new BergStak ® 0.50mm connectors.These are 0.50mm fine pitch connectors with a unique self-alignment feature, making it easy to work by operators, especially for low stack height.

SFP28 Cable Assembly, Active, 26AWG, 5M, 28G / Lane, Jacket

In ADAS, the connectors are used to connect sensors, computing, and several other components that make up the system. The circuits together work to transfer data, power, and signals between cameras, antennae, Radar-LiDar sensors, display units, and control units.

SFP+ Active Copper Cables Now On Sale [CablesOnDemand.com] at Amphenol Cables on Demand -- Active SFP+ Cables by Amphenol provide an ideal low-cost alternative to multimode SFP+ optical modules. Each Amphenol SFP+ Active Copper Cable Assembly emulates a pair of optical modules with complete system transparency, thus allowing you to cut your power budget in half and your cable budget by far more.

Our latest QSFP DD and OSFP interconnect product families support up to 25Gb/s NRZ or 56Gb/s PAM4 for up to 800G aggregated bandwidth. The product demo on QSFP DD and OSFP 800G Host Compliance Test Fixtures by Nat Stevens will throw more light on the features and applications of these high-speed interconnects. Active Optical Products

25% Increase in Current Density Compared to Existing Card Edge Designs! The NEW 3000W EnergyEdge ™ X-treme Card Edge series offers the highest linear density available in the market today. X-treme’s revolutionary dual contact design pushes the boundaries of card edge technology beyond 3000W to power modern system architectures.

OSFP OverPass products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external OSFP IO port by overpassing the PCB.

SFP+ Cable Assembly, Passive, 30AWG, 2.5M, 10G / Lane, Jacket

XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.

Exploring Interconnect Solutions for Next-Generation Immersion-Cooled Data Centers Sep 24, 2024

The D-Subminiature (D-Sub) interconnect system made its debut over 70-years ago in 1952 and while many technologies of the era have long since been retired, the d-sub continues to show its relevance today as one of the world’s most adaptable and reliable I/O platforms.

SFP+ Cable Assembly, Passive, 30AWG, 0.5M, 10G / Lane, Jacket

The contact pin’s shape, design and retentions are indeed among the key considerations for choosing a connector. Let us discuss about some of the most common and cost-effective pin retention designs that affect the performance of any connector.

SFP28 Cable Assembly, Passive, 30AWG, 0.5M, 28G / Lane, Jacket

FlexLock™ is compliant with USCAR-T2V2 and LV-214 S3 specs, with 2A per contact for high power. It has 2 pitch options, standard on 2.54mm and 3.20mm for larger creepage and clearance distances. FlexLock™ is built around a reliable dual beam contact system for excellent electrical performance and offers an active latch and Connector Positioning Assurance (CPA) to ensure a reliable ...

It is compliant with IEEE 802.3cm, QSFP DD CIMS 4.0, and QSFP DD Hardware 5.1. Amphenol Communications Solutions AirMax VS2® High-Speed Backplane Connector ... It has additional 2 pins compared to the SFP/SFP+ family, which enables it to have a second high-speed channel with an identical connector form factor. The DSFP shares the same unique ...

Memory modules can be defined as PCBs mounted with integrated-circuit-based memory. These are used in various computing applications ranging from notebooks and laptops to servers and data center. Memory module standards have evolved over generations to meet the growing demands of high-speed, data-hungry applications. Unlike earlier days when memory modules were designed specifically to meet ...

The rapid acceleration of technology evolution can be seen in the disruptive products regularly entering the market today. Advanced datacenters, crypto currency mining, autonomous vehicles, deep learning, and artificial intelligence applications are upending their spaces.