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FCI Basics offers reliable, cost-effective sensor cable solutions to detect cooling liquid leakage for applications using liquid cooling plates for thermal management. These tailor-made sensor cables uses conductive cooling liquid as a medium to form an electrical path between its electrodes, which lowers resistance and indicates liquid leakage.

They can be paired with multiple near chip IO solutions - Mini Cool Edge, Flash and SlimSAS™ with cabled sidebands to either the near chip connector, to a separate Minitek cable connector or press fit terminated at the QSFP connector.

OSFP 1x1 Low Profile Cage with 9.5Mm High Extruded Heat Sink. Environmental Compliance. Click to download Certificate of Compliance Report. Buy / Sample Product Drawing; 3D Model (STP) Datasheet; PRODUCT AND PRICE. PRODUCT & PRICE. Distributor. Distributor Stock Check. Symbol, Footprint & 3D. Related Parts. Related Parts ...

Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. As data rate requirements increase and devices and systems shrink, Ardent’s products deliver superior signal integrity in a dense footprint that can be reusable across programs to maximize cost savings.

performance are critical. Aggregates 200Gbps over its 4 channels (50Gbps/channel), hot-pluggable and quick to install, and backwards. any options of you want. Replace the cable only, keep the heat sink that dissipates the hot air upwards, transceiver. or plenty choices of cold.

Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass ™ solutions, optical transceivers and more. Here is a quick review of some of our newest products.

provide effective heat sink. In the hot regions, there is a black body for absorbing the infrared, which raises the temperature according to the intensity of the incident infrared. These thermopiles employ two different thermoelectric materials which are placed on a thin diaphragm having a low thermal conductance and capacitance. Amphenol

optional dust cover, p/n u79-111-9000-p (shipped loose) u95-w151-100a without rear pins u95-w121-100a u95-w1n1-100a heat sink option 1 = no heat sink or clip shipped 2 = fin style heat sink (nickel plated) and clip (h=6.5mm; san height) 3 = fin style heat sink (nickel plated) and clip (h=4.2mm; pci height) 4 = fin style heat sink (nickel plated) and clip (h=13.5mm; tall)

APC’s North American printed circuit operation provides tightly controlled processing working to meet your needs for initial prototype and mock-up builds through full rate production.

The MediaSensorTM (P51) family of bulk micromachined, absolute, sealed and gauge pressure sensors are for both harsh and benign media with superior accuracy over operating temperature. These compact, robust sensors are well suited for a variety of automotive, industrial and commercial applications. Maximum Operating Temp. Operating Temp.

The OSFP loopback units include integrated heat sinks that are a key part of the heat dissipative properties of the OSFP interconnect system. All loopback cable assemblies support 200G (8 lanes @ 25G NRZ), 400G (8 lanes @ 50G PAM4), or 800G (8 lanes @ 112G PAM4) signaling transmission.

Uncover these five common mistakes in designing lowpass filter circuits and learn how to avoid them to achieve the desired performance. 1. Overlooking Component Tolerances. What happens to military and aerospace systems when precision is compromised? Signal integrity, phase noise, and overall system performance degrade when precision falters.

MATERIAL: CAGE AND EMI SPRINGS: COPPER ALLOY CAGE PLATING: 2.54um [100u"] MIN. NICKEL. DUST COVER: CONDUCTIVE RUBBER HEAT SINK CLIP: STAINLESS STEEL HEAT SINK: NICKEL PLATED ALUMINUM ALLOY LIGHT PIPE: GE LEXAN, OPTICAL GRADE. AMPHENOL PART NUMBER U95-T3A1-104A IS SHOWN ON THIS PAGE. DIM. "H1" DIM. "H2" 37.00 MAX.

A Heat Sink Shipped Assembled (1X1 Only) Option 1 0 Standard 1 Cage with Light Pipe on Top 8 Cage with Half-Moon Mid G-Pins U77 X X X X X X X X X Dust Cover Option 0 Without Dust Cover D With Dust Cover (Shipped Loose) Plating 1 Bright Tin (for Wave Solder) 2 Nickel 3 Matte Tin (for Reflow 245°) Chassis Grounding 1 Metal Grounding Tabs

Amphenol's ExpressPort ® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, and replacing up to 4 standard SFP+ receptacles.

Amphenol's high density, cost effective cLGA and cStack solutions provide both a heat-sink opening and features for precise alignment of the interposers to the DMD and main PC Board. Use the documentation to the right to find the socket for the DMD for which you are designing.

HIGH SPEED PCIe/SAS INTERFACE IN A NEXT GENERATION FORM FACTOR. G14 Series OCuLink connectors are internal and external Small Form Factor PCIe connectors and cables optimized for the client and mobile market segments, while suitable for various datacom, consumer and industrial applications.

The highly engineered OSFP system has heat dissipative features that are an integral part of the cable, connector and cage designs. This eliminates additional heat sinks on top of the cages, minimizing the overall height of the connector system above the board.

Click on the Check Sample (if available) button to check the allowed sample quantity in the cart. You can also purchase additional quantity in the cart or buy directly using the Buy Now button below. The information below is for reference only. For more technical details, refer to product specification and application specification.