Search Results for slimline
Mobile Devices | Markets | Amphenol
D-Sub Slimline ULTRA SLIM D-SUB CONNECTORS FCI Basics has expanded the D-Sub connectors with a modified ultra-slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs ...
Fundamentals of Signal Integrity
The science of signal integrity makes use of the time, frequency, amplitude and phase characteristics of the signal to set certain rules and regulations to be adhered to obtain the best results. The much popular Laplace Transform used to convert time-bound characteristics of a mathematical function into their frequency-bound counterparts is ...
Amphenol Arrives at OCP Event in San Jose
Oct 13, 2023. The Open Compute Project (OCP) Global Summit is set to be a pivotal event for Amphenol, a leading global interconnect solutions provider. From October 17 th to 19 th, Amphenol will be at the San Jose Convention Center, unveiling an array of innovative products designed to revolutionize the world of data center connectivity.
Connectors | Products | Amphenol
D-Sub Slimline ULTRA SLIM D-SUB CONNECTORS FCI Basics has expanded the D-Sub connectors with a modified ultra-slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs ...
Components of Advanced E-Bikes - Amphenol CS
Basic components of E-Bikes. There are three primary components for an e-bike, which differentiate it from a normal bicycle: Battery Pack, Control Console, and Motor Unit. Like mentioned earlier, the battery pack is the powerhouse of an e-bike. Most modern e-bikes use lithium battery which is generally placed in the downtube or on the rear ...
Understanding Enterprise Solid State Drives (SSDs)
Understanding Enterprise Solid State Drives (SSDs) From mobile devices, laptops, to hyperscale data centers, the usage of storage devices in these equipment are well embedded in our daily lives. Though Hard Disk Drives (HDDs) were commonly used as a storage solution in early days, with the introduction of ultrabooks and other compact computing ...
OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module ...
Dec 3, 2018. Amphenol ICC’s OverPass ™ cabling Interconnect solution addresses hardware designer / architect’s need for a lower loss signal transmission path from the ASIC chip site to the external IO port or pluggable module interface. The system transfers high-speed signals to twinax cables shortly after they are launched from the chip ...
Exploring Autolock FFC/FPC Connectors
The versatility of the Autolock FFC/FPC connector is truly remarkable, making it suitable for a wide array of industries and applications. In the automotive sector, where vibration resistance and secure connections are paramount, these connectors shine. They meet LV214 S1 and USCAR-2 T3V2 qualifications, ensuring they can withstand the rigors ...
High Performing Military Connectors from Amphenol
Amphenol’s hybrid D-Sub connectors support signal, power, and coax making it suitable for wireless radio applications in the military. The IP67-rated rugged D-Subs are designed to withstand any tough condition, which makes them a perfect choice for military segments. These high-performance connectors are designed for severe-environment ...
Maximizing Network Efficiency with our High ... - Amphenol Connectors
OSFP is a groundbreaking form factor that supports eight high-speed electrical channels at 1.6 Tb/s (8x200G or 8x100G, 8x50G), and it can accommodate up to 32 ports per 1U front panel and 51.2 Tb/s per 1U swap slot. The OSFP optics are being developed to improve signal integrity and thermal performance to support the next generation optics also.
Types of Memory Modules and Their Applications - Amphenol CS
The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). SIMM was one of the earliest multichip memory modules used in PCs, generally with 30pins and 70pins, and a 32–bit data path. This was soon replaced by DIMM with a 64-bit data path and separate ...
Wireless Network Solutions - Charles Industries
In line with the increasing demand for housing edge computing infrastructures at node sites, Charles Industries offers secure, self-contained edge computing enclosure solutions. These enclosures eliminate the need for a dedicated building structure, providing protection that exceeds that of electronic equipment cabinets and sheds.
Amphenol’s Popular Demos at ECOC 2022
Amphenol’s Popular Demos at ECOC 2022. Sep 16, 2022. The European Conference on Optical Communication (ECOC), Europe's largest Optics event is all set to happen from September 19th to 21st, 2022. Amphenol is proud to be a part of this exhibition as a leading innovator in the development and manufacturing of Active Optical Cables.
Innovation Helps Amphenol Reduce Environmental Impact by 78Million Kg CO2
Partnering with Xtalic has enabled Amphenol to dramatically reduce the environmental impact of materials used, totaling more than 78 million kg CO2 equivalent in the last ten years. Xtalic technology for nanocrystalline metals enables a reduction in the amount of gold consumed in electrical connector applications.
PCIe® 6.0- The Ultra-Speed Computing Standard - Amphenol CS
PCIe ® 6.0 Specififcations. Now PCI-SIG has announced its sixth generation, the PCIe ® 6.0, which is targeted to be released by 2021 and is designed to meet the evolving trends including Artificial Intelligence and Big Data. The new standards will be introduced with double the data rates i.e, it will take a leap to 64GT/s from the 32GT/s of ...
Connecting to Open Source Hardware - Amphenol CS
A consortium known as the Open Compute Project Foundation (OCP) endorses and publicly releases data center designs from its member OEMs like Facebook and Microsoft. These designs can be utilized by every other aspiring vendor to their clients’ benefit. There are separate open source designs for server, storage, networking, and power equipment.
RET Control Units
Dual version of our MDCU module for the remote control of the electrical downtilt on SLIMLINE, TWINLINE, ULTRALINE, HIGH BAND, CYLLINE and TRIO antennas Two independent inputs for antenna sharing with separate control from two different RET controllers / NodeB Capable of different protocols: AISG 1.1, 3GPP/AISG 2.0, Ericsson
ITA Showcase Northwest (with Tri West Sales)
Fiber Interconnect Terminals – Slimline (CFIT-SL) Fiber Interconnect Terminals – Multi-Compartment (CFIT-D3) Fiber Terminal Enclosures – Indoor. Fiber Wall Solutions (CFWS) Fiber Terminals, Building (CFBT) Fiber Building Terminal – Multi-Compartment (CFBT-D3) Fiber Distribution Hub & OLT Cabinet (OBC) – Outdoor
Amphenol Exhibits and Demos at DesignCon 2022
Amphenol Exhibits and Demos at DesignCon 2022. DesignCon, the largest event for Chip, Board, and Systems Design Engineers, brings together the brightest talents across the world. This premier gathering has the legacy of more than two decades in solving the signal and power integrity challenges and creating innovative design solutions for tomorrow.
Input Output | Connectors | Amphenol
D-Subminiature High Power Series. *75A HIGH POWER CONTACTS WITH CRIMP, SOLDER BUCKET, AND PCB TERMINATIONS Amphenol's D-Subminiature... D-Sub Power Board-Mount Connectors. PERIPHERAL I/O CONNECTORS WITH FULL AND MIXED POWER CONTACTS Amphenol's D-Sub Power Board-Mount Connectors... D-Sub High Density Board-Mount Connectors.