Search Results for slimline

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PCIe M.2 Connectors, Storage and Server Connector, Pitch = 0.5mm, Height = 3.2mm, Key M, 30μin Gold Plating.

Amphenol Charles Industries Announces a New Z01 Series Low Profile Broadband Pedestal Housing. Schaumburg, IL (Feb 20, 2024) – Amphenol Charles Industries announces the availability of its Z01 series pedestals.

Marine & Industrial Owner’s Manual Archive. This archive includes owner’s manuals for Marine & Industrial products that have been Manufacture Discontinued and are no longer offered for sale by Charles Industries.

Shanghai Amphenol Airwave Communication Electronics Co., Ltd, a subsidiary of Amphenol Corporation has partnered with NuCurrent, a global player in wireless power systems. This partnership will address the need to shift toward new standards such as Qi2 (pronounced “cheē tü”) standard. “Our partnersh

Charles Industries is the top manufacturer of buried distribution plant facilities, including the Pedlock® Magnum™ CPLM Series Pedestals for Telecom applications. Request a Quote now!

Fiber Terminal Enclosures – Indoor. Fiber Wall Solutions (CFWS) Fiber Terminals, Building (CFBT) Fiber Building Terminal – Multi-Compartment (CFBT-D3)

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The EDSFF 2-piece cable solution supports data rates of up to PCIe ® 5.0 at 32Gb/s. It utilizes the EDSFF standard interface Mini Cool Edge 1C/2C connectors on one cable end, offering flexibility in connector form factor selection such as MCIO, Multi-Trak ™, Backplane connectors, and more on the other end.. Ideal for high-speed computing data center server systems, this solution eliminates ...

Magnets for triaxial sensors MT075 MT075A Pull strength 75 lbf Diameter 1.50 in Height 0.75 in Thread 1/4-28 10-32 Temporary mounting solutions Magnetic mounting bases Magnetic bases are a quick and convenient option for walkaround applications, and are often used on large machinery.

Cost-Effective Wall Mount Enclosures for Small Count Fiber Patch & Splice Applications in a Fiber Optic Network. Charles Fiber Wall Solutions (CFWS) provide simple, cost-effective enclosures for patch and splice requirements within virtually any indoor application.

The LiteVu™ Optical Monitoring System is a cost-effective solution for non-intrusive monitoring of power and transmission of an optical link, assisting operators in ensuring the performance and reliability of their optical infrastructure.

Amphenol’s OSFP product portfolio offers customers a comprehensive and integrated link solution that features DAC copper cables, AOCs, stacked and ganged board connector and cage solutions.

Amphenol Charles Industries (ACI) Fiber Drop Repair Closures (FDRC) are very compact units. They can be used as a repair closure or a small splice closure for a single can accommodate up to 4 single fusion splices.

C-10 Type Cable Stubs Charles Industries’ C-10 type cable stubs are fully color-coded PIC cable with either ALPETH (C-10A1) or PASP (C-10B1) sheaths.

Amphenol Product Application Specification For 0.65pitch Vertical Slim Cool edge Connector Product Spec. # S-SE-005 Date : 07/25/18 Rev. E ECN # CD1356 Page : 1 of 8 Product Application Specification For 0.65pitch Vertical Slim

5876400 3-Band, 6-Port, 65°, XPOL, Panel Antenna, Variable Tilt, 1390 mm Quoted performance parameters are provided to offer typical or range values only and may vary as a result of normal manufacturing and operational conditions.

Standards and specifications from various organizations provide a guideline to manufacturers in measuring the quality of their product. This helps to ensure end customers are purchasing a trustworthy and high performance product. Standards are increasingly important in the Automotive Industry.

Broadband Equity Access & Deployment Program (BEAD) and Build America, Buy America Act (BABAA) compliant* Charles Industries’ Z05 and Z06 Series Vented Vertical Pedestals provide ease of installation and

The cLGA Land Grid Array socket system is a low cost, high signal integrity, and high reliability offering from the Amphenol ICC family to bring conventional connector material construction to high-performance chip-to-board applications.