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ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124) is now added to the list of CC-Link IE TSN Specifications Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today that the CC-Link IE TSN Specification List for March 2023 will now include ix Industrial™ (10-pin rectangular connector compliant with IEC 61076-3-124).

0.50mm FFC/FPC Connectors. The 0.50mm pitch FFC/FPC connectors come in multiple heights and are vibration-proof. These connectors offered with top, bottom, dual beams and dual contact positions in both ZIF (Zero Insertion Force) and Non-ZIF cable terminations utilize 0.50mm contact spacing to terminate mobile devices across a variety of applications.

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

8 C703A Hybrid • 500.000 mating cycles for both chip and magnetic stripe • landing, self-cleaning contacts • gimballed magnetic head • card presence switch

Amphenol ICC launched the new Cross-Mate™ 2.00mm to mark the beginning of 2020 in January. These wire-to-board connectors offer a compact design and can be used in various applications in consumer, industrial, medical and automotive fields.

Fiber Terminal Enclosures – Indoor. Fiber Wall Solutions (CFWS) Fiber Terminals, Building (CFBT) Fiber Building Terminal – Multi-Compartment (CFBT-D3)

Amphenol ICC is launching the next generation high-speed ruggedized connectors for future industrial ethernet communication designs. We have collaborated with key interconnect technology partners Hirose Electric and Harting Technology Group to release the new ix Industrial ™ series of connectors. The IEC 61076-3-124 compliant ix Industrial ™ connectors are ideal for various applications in ...

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

Omni-Path is a high-performance, low latency hardware and software architecture developed by Intel that delivers signal transmission performance for tomorrow’s high performance computing (HPC) workloads, at a better performing, and cost competitive rate when compared with today’s network fabrics.

The D-Subminiature (D-Sub) interconnect system made its debut over 70-years ago in 1952 and while many technologies of the era have long since been retired, the d-sub continues to show its relevance today as one of the world’s most adaptable and reliable I/O platforms.

Membrane switches have revolutionized the way users interact with various electronic devices. Unlike traditional mechanical switches, which rely on copper and plastic bases, membrane switches leverage printed circuits on flexible films.

With a speed twice as much as the industry standard, Paladin’s ® game-changing 112 Gb/s backplane interconnect technology sets the benchmark for signal integrity performance in backplane interconnects. It has no stub resonance from signal contacts and demonstrates a smooth linear transmission beyond 40GHz.

DesignCon being the largest chip, board, and systems event in the industry witnesses the launch of many innovative products. Amphenol ICC will be is launching three high-speed server connectors at DesignCon 2020: Right Angle PCIe ® Gen 4 CEM connectors, Gen Z 4C-HP Mini Cool Edge connectors and Double Density Cool Edge connectors.. PCIe ® Gen 4 CEM Connectors (RA)

Amphenol Communications Solutions introduced its innovative DuraSwap ™ Concentric Connectors and Type 6 Charging Gun solutions, designed and manufactured in India at the Bharat Battery Show 2025.

TR Multicoax Equal Trace delivers superior signal integrity from multiple high speed channels in an arc footprint. This is an ideal solution for applications where equal and short trace lengths are imperative for performance tuning.

Minitek ® and BergStak ®. Amphenol's Minitek ® and BergStak ® series provide modular board-to-board connectors suitable for a wide range of applications, including medical wearables. These connectors offer various pitch options and stack heights, allowing flexible design configurations. With high-speed data transmission capabilities and reliable connectivity, they can benefit from portable ...

As the electric vehicle market continues to grow, the importance of the battery pack and its component parts cannot be overstated. At the heart of the battery pack is the cell connection system (CCS), which plays a critical role in ensuring the reliable performance and longevity of the battery.

The HSD connector system (High-Speed Data), compliant with USCAR-2 specification, is a fully shielded interconnect system designed for transmitting high-performance digital signals at low voltages. It is built to prevent interference from both external sources and crosstalk. This system is widely used in various functions in automobiles such as ADAS, Body Control Units, Cameras, GPS, Security ...

Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass ™ solutions, optical transceivers and more. Here is a quick review of some of our newest products.

Fiber Terminal Enclosures – Indoor. Fiber Wall Solutions (CFWS) Fiber Terminals, Building (CFBT) Fiber Building Terminal – Multi-Compartment (CFBT-D3)