Search Results for slimline

In the fast-paced world of modern electronics, the demand for compact and lightweight devices continues to soar. Flex-to-board connectors enable flexible and high-density interconnects between printed circuit boards (PCBs), LCDs, and various electronic components. As a result, they are increasingly adopted in automotive, smartphones, tablets, laptop PCs, wearables, robotics, and medical ...

Hyperscale computing refers to the facilities required in distributed computing environments to efficiently scale from a few severs to thousands, and is commonly used in environments such as Big Data and Cloud Computing.

Supporting 56G and 112G signaling in hardware system designs, Amphenol’s DensiLink ® OverPass ™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. DensiLink ® enables arrayed connector layouts for near chip / on package IO solutions - allows for cascaded cable routing and highest differential pair count interconnection near ...

TR Multicoax Equal Trace delivers superior signal integrity from multiple high speed channels in an arc footprint. This is an ideal solution for applications where equal and short trace lengths are imperative for performance tuning.

Visit Us at SCTE TechExpo in the Amphenol Broadband Solutions' Exhibit #1131, September 24-26, Atlanta, GA Click here for more information

Amphenol’s CTW (Card-To-Wire) Fan Module connectors come with a flexible design for card-to-wire power applications used in fan modules.

Amphenol’s OSFP product portfolio offers customers a comprehensive and integrated link solution that features DAC copper cables, AOCs, stacked and ganged board connector and cage solutions.

Electrical vehicles comprising of cars, buses, and two-wheelers, offer a noiseless and comfortable ride. These vehicles carry rechargeable batteries that power the electric motors responsible for the propulsion.

Amphenol ICC’s InfinX® is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX® is the best choice for high speed board-to-board applications.

With many applications like AI, data analytics, machine learning, and image recognition getting mainstream, the demand to process and transmit massive data securely in the least time is increasing.

Lowest Cost of Ownership for Next Generation Networks. Charles Industries supplies coaxial and fiber optic enclosure systems that are easy to deploy, field-proven for long service life and cost saving for MSO outside plant networks as well as for critical infrastructure enclosure applications.

The Expected Rise of Machines The past decade has witnessed massive advancements in hyperscale datacenters and rise in connected devices leading to the annual global data growth exceeding several trillion gigagbytes.

The invention of modular jacks is considered to be a significant event in the history of communications connectors. Originally introduced in the 1970’s, modular jacks were first used to facilitate the growing complexity of telephone systems in North America. Prior to the arrival of modular jacks, te

Amphenol is set to make a significant presence felt at the highly anticipated Open Data Center Committee Summit (ODCC) 2023, slated to be held at the Beijing International Convention Center from September 13 to September 14 at booth A06.. The ODCC Summit, a prominent event in China's Data Center landscape, brings together key players in the field.

Peripheral Component Interconnect Express (PCIe ®) is the most common standard for high speed interface that connects various server and storage components with the motherboard.Amphenol has an array of Card Edge connectors supporting PCI Express ® Gen 3, Gen 4 and Gen 5 standards along with PCIe ® M.2 Connectors which provide high performance and differential signaling in low profiles.

Amphenol CS is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. Amphenol’s broad range of products enable design engineers to achieve their performance targets.

Our latest high-performance automotive grade products like Ve-NET™ Automotive Multigigabit Differential Connector System, 0.50mm Power Pin Floating Board-to-Board Connectors, 0.50mm FFC/FPC Connectors with Autolock Mechanism - F308/F332 Series, FlexLock® FPC-to-Board Connector, and HSBridge+ connector complies with USCAR2.. LVDS stands for Low-Voltage Differential Signaling and is a global ...

0.50mm pitch flex connectors utilize 0.50mm contact spacing to terminate mobile devices across a variety of applications. These connectors are offered with top, bottom, dual beams & dual contact positions with both ZIF and Non-ZIF cable terminations.

Leading Contributor to OCP Power Applications Launches Busbar Connectors Performing to OCP ORv3 Specifications. Pennsylvania, USA – Amphenol Communications Solutions is pleased to announce today, the release of its BarKlip ® BK500 IO and BarKlip ® BK150 IO busbar connectors. These high-current connectors are fully compliant with OCP ORv3 power output and IT gear specifications supporting ...

The stage is set, and Amphenol is all geared up to showcase its trailblazing technologies at Electronica India 2023, to be held from September 13 th to 15 th in Bangalore, India.This premier event promises to be an exhilarating showcase of the latest advancements in the electronics industry, and you can catch us in Hall 5 – Booth #EE91.. Unveiling India Manufacturing Capabilities: