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Buy 1.5ft Amphenol CO-174BNCX200-001.5 Cables Direct from the Factory at Cables on Demand. RG174 BNC Coaxial Cable Assemblies by Amphenol combine 50 Ohm RG174 micro coax cable with pre-terminated BNC Male connectors for a flexible low-profile interface with your RF equipment. Performance beyond 6 GHz is guaranteed with our 90% tinned copper braid shielded MIL-C-17 type RG174/U coax.

4 Temperature Amphenol Advanced Sensors temperature sensors are suitable for numerous applications of Tier 1 and OEM products. We tailor sensing elements to your systems,

PowerShift Metro provides cost-efficient, configurable and unobtrusive power delivery to small cell networks. View all: Power management. Power conversion. Back to Products RF conditioning. RF conditioning. Resulting from 50 years of innovation, ANDREW offers RF conditioning solutions for a wide range of applications. Our sustainable portfolio ...

LID Technologies stands for innovative know-how in TPMS, wireless electronics systems and pure automotive quality culture. The company has become one of the leading companies in the world creating such technologies.

Outline of Sensor Packaging and Pin Arrangement Temperature Accuracy (Typical)-4-3-2-1 0 1 2 3 4 Te m pe r a t u r e D e v i a t i on ℃ O bject Tem p. : 60℃ 0 20 ...

sensors in surface mount packages. An ultra-small Silicon Fusion Bonded (SFB), ultra-high stability SenStable® piezoresistive chip from NovaSensor is placed in a plastic package that exploits high volume, leadframe package technology to bring forth a low-cost sensor alternative to the OEM user. The NPP-301 Series produces a voltage output that

External Document Links Handling Instruction.pdf Ordering_code.pdf Solution Overview_2.pdf Notes PRODUCT DATASHEET HB012-1-04U1-S2J HYBRIFLEX™ Standard LTE, Cabling Solution for 1 RRU HB012-1-04U1-S2J REV : E REV DATE : 30 Mar 2021 www.rfstechnologies.com All values nominal unless tolerances provided; information contained in the present datasheet is subject to confirmation at

TFC Product Information Sheet Type: Passive RF Digital Splitter, 5-1002 MHz 3-Way, Unbalanced Document: tfc-dsv10036r u.doc Revision: 5.6.2013

sensors in surface mount packages. An ultra-small Silicon Fusion Bonded (SFB), ultra-high stability SenStable® piezoresistive chip from NovaSensor is placed in a plastic package that exploits high volume, leadframe package technology to bring forth a low-cost sensor alternative to the OEM user. The NPP-301 Series produces a voltage output that

Low-Profile Co-location Platform Kit, 12 ft face, 10 in to 30 in OD, includes pipe

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The ANDREW PowerShift ® portfolio facilitates highly efficient power delivery to macro and small cell networks. PowerShift Macro optimizes energy management for all RRU deployments and can help reduce operating costs. PowerShift Metro provides cost-efficient, configurable and unobtrusive power delivery to small cell networks. View all: Power ...

Inner Box : 500 ea Out Box : 5,000 ea Standard Digital (I²C ) Output : Factory setting is Sleep Mode and calibrated at 3.3V. Pin Connection Package Contents ChipCap® 2-SIP consists of a ChipCap 2 and a V-core capacitor soldered on the top of a FR4 substrate. Lead Pins are made of Cu, Sn, P alloy and all parts are fully RoHS and REACH compliant.

additional assemblies - 1 strand sm fiber length, ft model number 10 fr-n-1ssm-01-10fs 15 fr-n-1ssm-01-15fs 20 fr-n-1ssm-01-20fs 30 fr-n-1ssm-01-30fs