Search Results for ultrapass amphenol.
UltraPass OverPass Assemblies | High Speed Input Output | Amphenol
UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. Full support of up to 224G signaling speeds; Reduced overall system cost; Lower loss interconnect from chip site to external port; Lower loss interconnect from chip site to ...
Revolutionizing Data Transmission with UltraPass ... - Amphenol CS
Enter UltraPass ™ OverPass ™ Assemblies by Amphenol, a game-changing technology that is set to redefine data transmission as we know it. UltraPass ™ represents a paradigm shift in interconnect design, offering arrayed connector layouts for near-chip and on-package IO solutions.
Tag Archives: UltraPass - Amphenol CS
UltraPass™ OverPass™ Assemblies by Amphenol is a game-changing technology that is set to redefine data transmission requirements of the future. [Read more] The quest for speed, reliability, and innovation is relentless in the ever-evolving landscape of connectivity solutions.
Navigating the Speed of Tomorrow: Unveiling 224G High ... - Amphenol CS
Our UltraPass™ Internal High-Speed IO solution offers low-loss arrayed connector layouts for a direct link from chip to pluggable modules, anywhere in the system. With support for signaling speeds of up to 224G, UltraPass™ is the epitome of high-speed, high-density connectivity.
Paladin ® HD 224Gb/s Backplane Interconnect System - Amphenol CS
INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S. The Paladin ® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing.
224G High-Speed Solutions - Amphenol CS
UltraPass™ Internal High Speed IO. Near an ASIC to a card or board’s location in the system. Delivering a simple, low-loss, direct link to pluggable modules or anywhere in the system; High speed, low profile and high density (bandwidth / mm 2) near chip and on package solutions, the successor to our microLinkOVER™ and DensiLink™
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UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. OverPass Solutions - High performance assemblies enabling signal routing through cable flyover instead of PCB.
OverPass™ Internal High Speed Interconnect - Amphenol CS
UltraPass™ OverPass™ Assemblies. Full support of 224G signaling speeds; Reduced overall system cost; Lower loss interconnect from chip site to external port; Short signal travel length from cable to board pad; Delivers superior signal integrity performance
OverPass™ High Speed Bulk Cables | Cable Assembly - Amphenol CS
Amphenol CS’s OverPass™ cable assembly portfolio utilizes Spectra-Strip's high frequency SkewClear EXD cable technology and manufacturing expertise to offer High Speed Bulk Cable solutions.
OverPass™ External High Speed Interconnect - Amphenol CS
UltraPass™ OverPass™ Cable Assemblies. Highest density (diff pair / mm2) near chip / on chip offering in the market. Supports up to 224G per lane. 16, 32, 40 and 64 diff pair configurations available.
Amphenol showcases its leading high speed interconnect at DesignCon 2024
The live demonstration will feature Amphenol Paladin ® HD2 right-angle female (RAF) board mount connector, a Paladin ® HD2 pass-thru cable assembly, and UltraPass™. UltraPass ™ is Amphenol’s newest OverPass ® solution for providing high-density, 224 Gb/s performance for near-ASIC interfaces.
2024 Wrapped: What’s the Buzz at Amphenol this year?
This year, Amphenol has unveiled several innovative products that enhance high-speed connectivity solutions like the Paladin ® HD2 224Gb/s Backplane Interconnect System and UltraPass ™ OverPass ™ Assemblies, finding applications in Data Centers, Supercomputers, and AI/ML applications to mention a few.
Amphenol’s Newest High Speed Interconnect Offerings
Amphenol offers an array of high speed interconnect solutions, suitable for next generation speed and density requirements. Our extensive portfolio includes high speed backplane connectors, copper cable assemblies, loopback modules, OverPass™ solutions, optical transceivers and more.
OverPass™ Cabled Backplane | High Speed - Amphenol CS
Amphenol CS offers high-speed cabled backplane solutions meeting 112G PAM4 PCIE SFF-TA-1016 standards supporting cable mating with backplane cable, press fit headers, right angle and orthogonal configurations.
OverPass™- The High Speed Solution - Amphenol CS
Amphenol’s OverPass ™ cable system allows for the transfer of high-speed signals to twinax cables shortly after they are launched from the ASIC. This enables a simple, low-loss, direct link to pluggable modules or anywhere in the system.
OverPass Cable System - Amphenol CS
UltraPassTM OverPassTM Assemblies • Direct point-to-point connection; high-density two-piece IO connector and cable system • Full support of up to 224G signaling speeds • Lower loss interconnect from chip site to chip site • Highest signal speed in the industry
OverPass™ Cable System - Amphenol CS
Amphenol OverPass cable system offers a broad range of capabilities that allow our customers to ef?ciently transmit high speed signals from near an ASIC to anywhere in their system.
OverPass™ Interconnects – Your high speed , Low Loss Chip-to-Module ...
These high-speed OverPass ™ solutions address requirements for a low loss, chip-to-external port interconnect link and meet a wide range of signaling speeds for both current and future applications.
Tag Archives: OSFP - Amphenol CS
UltraPass™ OverPass™ Assemblies by Amphenol is a game-changing technology that is set to redefine data transmission requirements of the future. [Read more] In this blog, we’ll break down and understand OSFP connectors, their features, benefits, and specifications. What is an OSFP?
Tag Archives: QSFP DD - Amphenol CS
In today's fast-paced digital landscape, where speed, reliability, and efficiency are paramount, the demand for cutting-edge interconnect solutions has never been greater. UltraPass™ OverPass™ Assemblies by Amphenol is a game-changing technology that is set to redefine data transmission requirements of the future.