Search Results for ultrapass overpass connector

These Cable Assembly Connectors include QSFP DD, QSFP+, OSFP, CXP, SFP+ etc. ... UltraPass OverPass Assemblies | High Speed Input Output - Amphenol CS Full vertical integration of product components: Connectors and cable supplied, processed, terminated and tested by Amphenol; Provides full confidence in the whole system reliability; 16, 40, and ...

Buy 3m Amphenol CS-USBAA00000-003 Cables Direct from the Factory at Cables on Demand. This Premium USB cable is USB 2.0 compliant with a transfer rate of up to 480 megabits per second.

UltraPass OverPass Assemblies | High Speed Input Output | Amphenol 224G CONNECTION DIRECTLY FROM CHIP SITE TO EXTERNAL PORTS. UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market.

ExaMAX is a beam-on-beam contact interface connector that supports data rates from 25Gb/s to 56Gb/s. It has low crosstalk, insertion loss, and mating forces, and is compatible with various industry specifications and applications. ... UltraPass OverPass Assemblies | High Speed Input Output | Amphenol

Search Results for 22090604cc-1 Mil-Spec and Custom Circular Connectors - Amphenol Aerospace Mil-Spec Type Circulars. Amphenol designs and manufactures a complete range of Mil-Spec connectors including MIL-DTL-38999, 26482, 5015, and 83723. ... UltraPass OverPass Assemblies | High Speed Input Output - Amphenol CS ...

I 6 I Temposonics® EP / EL SSI Data Sheet ORDER CODE a Sensor model L Ultra low profile P Compact profile d Connection type D 8 4 (M12) 8 pin male connector e Operating voltage 1 +24 VDC (−15 / +20 %) c Stroke length X X X X M 0050…2540 mm X X X. X U 002.0…100.0 in. b Design 0 Without position magnet */ Non standard stroke lengths are available; must be encoded in 5 mm / 0.1 in. increments

UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. OverPass Solutions - High performance assemblies enabling signal routing through cable flyover instead of PCB.

UltraPass OverPass Assemblies | High Speed Input Output - Amphenol CS UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. ...

Amphenol has been designing and manufacturing electrical and electronic connectors since the company’s inception in 1932. For nearly a century, we’ve been helping customers transmit power, data and signal in the harshest environments, from subsea applications to the outer reaches of space and everywhere in between. ... UltraPass OverPass ...

The Amphenol Micro-D connector series (M83513) offers proven military spec performance and reliability in rectangular and stripline micro connectors. The Micro-D connectors are available in rectangular D, strip and custom card edge configurations, with contacts on .050 (1.27) centers. Inserts in Micro-D miniature connectors with signal and coax ...

Amphenol's BrightConnX™ lighting connectors have emerged as a leading solution in the lighting industry, offering compliance with key standards bodies such as NEMA/ANSI and Zhaga. These versatile connectors find application in a wide range of lighting scenarios, including exterior lighting, street and area lighting, and interior lighting.

UltraPass OverPass Assemblies | High Speed Input Output | Amphenol Full vertical integration of product components: Connectors and cable supplied, processed, terminated and tested by Amphenol; Provides full confidence in the whole system reliability; 16, 40, and 64 differential pair configurations; Choice of multiple IO solutions to address ...

Amphenol's 100G QSFP28 optical modules include SR4, AOC, AOC break out, CWDM4, LR4, ER4 Lite, ER4 and ZR4 series, which adopt LC or MPO optical ports and are compatible with IEEE802.3bm, SFF-8636 and other standards; With low power consumption and small size, it is mainly used in 100G data center internal network, data center interconnection ...

Environmental Sealing: IAW connector specification Corrosion Resistance: 500 hours salt spray EMI Shielding: 360 degree shielding on each pair Mating Cycles: 500 cycles Voltage Rating: 500 Vrms max @ sea level Dielectric Withstanding Voltage: 500 VAC RMS sea level Temperature Range:-65C to 175C Bandwidth: Up to 1.25 GHz Data Rate: Exceeding 2.5 Gbps.

Model EB:10-32 coaxial plug, strain relief boot . 10-32 coaxial plug, strain relief boot. Protective Cap: 085A18. Connector Style: Coaxial

UltraPass OverPass Assemblies | High Speed Input Output | Amphenol UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. ... Connectors and cable supplied, processed, terminated and tested by Amphenol; Provides full confidence ...

UltraPass OverPass Assemblies | High Speed Input Output | Amphenol ... The B-Series is a compact single pole high voltage connector system capable of operating as high as 40 kVDC. The quarter turn locking system ensures that the plug and receptacle remain properly mated during operation.

Search Results for fpc inmeta:gsaentity_divisions=amphenol%20fci FCI Basics High-Speed flex connectors can transfer data rates up to 10Gb/s. It has a 0.30mm pitch, in-line layout and backflip actuator coupled with locking feature for strong FPC retention.High-speed FPC provides a low profile and compact solution while maintaining high-speed ...

UltraPass OverPass Assemblies | High Speed Input Output - Amphenol CS UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market. Full support of up to 224G signaling speeds

This year, Amphenol has unveiled several innovative products that enhance high-speed connectivity solutions like the Paladin ® HD2 224Gb/s Backplane Interconnect System and UltraPass ™ OverPass ™ Assemblies, finding applications in Data Centers, Supercomputers, and AI/ML applications to mention a few.