Search Results for xcede

Introduction. In an era where data speeds define technological progress, Amphenol's latest innovation, the PCI Express ® DirectAttached ® CEM Card Edge Connectors, emerges as a game-changer.Engineered with cutting-edge technology, these connectors are set to revolutionize the landscape of data transmission, offering unparalleled performance and flexibility.

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets.

XCede® Family Cable Assemblies Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance ...

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

The connectors mentioned above handle connections between different units; however, inside the CCU, connections must also transfer power and data between PCB stacks.Data transfer inside the CCU utilizes the PCIe ® protocol while communication between the CCU and ECUs is based on Ethernet protocol due to Ethernet's capability to reach longer lengths (up to 15m).

XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required ...

High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology. Power requirements for AI model training are increasing to over 100kW per rack in some use cases, of which air-cooling fans alone account for up to 15% of server power cons

The invention of modular jacks is considered to be a significant event in the history of communications connectors. Originally introduced in the 1970’s, modular jacks were first used to facilitate the growing complexity of telephone systems in North America. Prior to the arrival of modular jacks, te

Finding the right connector based on your requirements is much easier now using our product configurators. You can select different parameters such as pitch sizes, plating options, terminations, mating length, tail length, pin style, signal and power pins, amongst many key product attributes.

The introduction of 224G PAM4 technology plays a pivotal role in the evolution of data center connectivity. With unprecedented speed, enhanced bandwidth, and robust system architecture, this Gigabit Ethernet solution is set to redefine the capabilities of data centers, enabling them to keep pace with the rapidly advancing landscape of AI and data-intensive applications.

The contact pin’s shape, design and retentions are indeed among the key considerations for choosing a connector. Let us discuss about some of the most common and cost-effective pin retention designs that affect the performance of any connector.

Amphenol Communications Solutions Pioneers Innovation: Launches Two Made-in-India Tech Solutions at Bharat Mobility Global Expo 2025 Jan 22, 2025

Amphenol is proud to announce that Yifan Huang and Stephen Smith will present a technical paper titled “PCIe Gen 5 CEM Connector and Add-In Card PCB design optimizations” at DesignCon 2019.

Apart from this Amphenol's high power backplane connectors include high-speed XCede ® used in data centers, fully shielded I/O interconnect system SOFIX ®, DIN-41612 based high and medium power DIN connectors, and Millipacs ® 2.00mm modular board-to-board or cable-to-board Hard Metric Hybrid connectors. High-Power Card Edge Connectors

A. AgilBrick™ 1.27mm Board-to-Board Header G802 ; AgilBrick™ 2.00mm Board-to-Board Header G825 ; AgilBrick™ 2.54mm Board-to-Board Header G800

The D-Subminiature (D-Sub) interconnect system made its debut over 70-years ago in 1952 and while many technologies of the era have long since been retired, the d-sub continues to show its relevance today as one of the world’s most adaptable and reliable I/O platforms.

Amphenol provides USB Type C that supports a variety of protocols such as USB2.0/3.0/3.1.The Lite version of USB 2.0 Type C connectors come with top and middle mount options in 16 pins.

InfiniBand stands tall as a stalwart in the realm of high speed computing interconnect solutions. With its high bandwidth, low latency, and support for multiple topologies, InfiniBand is a go-to choice for clusters handling intensive computational tasks.

XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.

ExaMAX^® backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion. Each s