Search Results for xcede

XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.

The introduction of 224G PAM4 technology plays a pivotal role in the evolution of data center connectivity. With unprecedented speed, enhanced bandwidth, and robust system architecture, this Gigabit Ethernet solution is set to redefine the capabilities of data centers, enabling them to keep pace with the rapidly advancing landscape of AI and data-intensive applications.

The contact pin’s shape, design and retentions are indeed among the key considerations for choosing a connector. Let us discuss about some of the most common and cost-effective pin retention designs that affect the performance of any connector.

FlexLock™ is compliant with USCAR-T2V2 and LV-214 S3 specs, with 2A per contact for high power. It has 2 pitch options, standard on 2.54mm and 3.20mm for larger creepage and clearance distances. FlexLock™ is built around a reliable dual beam contact system for excellent electrical performance and offers an active latch and Connector Positioning Assurance (CPA) to ensure a reliable ...

XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.

XCede® HD2 DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. ...

PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025

In addition to these styles, there are many other board termination styles, including Land Grid Array (LGA) and the patented Ball Grid Array (BGA) that find applications in high-speed mezzanine connectors like cLGA ®, cStack ™, M-Series ™, MEG-Array ®, and Chameleon ®.There are also wire termination styles that deal with how the wire is attached to the contacts of the connector ...

Engineers can design faster with free E-CAD and M-CAD models for Amphenol Communication Solutions (ACS) connectors available on the Amphenol San Francisco, CA – (September 27, 2022) - Amphenol Communication Solutions, a world leader in interconnect solutions. and SnapEDA, the first search engine for electronic design, are releasing over 21,000 new digital models to help designers bring their ...

XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.

BLOOMINGDALE, Ill.--(BUSINESS WIRE)--Apr. 7, 2022-- PCTEL, Inc. (Nasdaq: PCTI), a leading global provider of wireless technology solutions, today announced a strategic alliance with Stargent IoT, an Internet of Things (IoT) company providing IoT solutions for an array of use cases for smart manufacturing, process automation and asset tracking.PCTEL’s alliance with Stargent IoT will provide ...

In this blog, we’ll break down and understand OSFP connectors, their features, benefits, and specifications. What is an OSFP? Octal Small Form-factor Pluggable (OSFP) is a pluggable form factor developed by the OSFP MSA group, which was launched by Google and led by Arista Networks.

Market leading backplane connector families - XCede®, Paladin®, and ExaMAX ®. Proven reliability of passive twin ax copper coupled with advanced wire attachment and 100% high speed test coverage provides peace of mind. FEATURES.

Amphenol is partnering with Keysight and MultiLane at DesignCon 2025 to showcase cutting-edge technology at their respective booths this year. We are excited to invite you to attend them and interact with our experts and gain insight on the latest products and technologies we will be showcasing.

FlexFast ™ Flex-to-Board: Gold plating process for terminals: Reduces the force required for the mating and un-mating process ensuring smooth connections. Max 8.00mm height: This feature is a space-saver as it allows for designs in compact applications. Connector Position Assurance (CPA) & Flex Position Assurance (FPA): Ensures connectors are properly mated, and locked together as well as ...

XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required ...

XCede® | Backplane Connectors | Amphenol While maintaining the same mating interfaces, XCede connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.

XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.

A circular connector can be defined as a circular interface with cylindrical contact housing. These connectors are used in various industries for data, signal and power connections in the AI, military, aerospace, data, communication, and manufacturing.

The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. ...