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High-Speed Bulk Cables for 224G Connectivity - Amphenol CS
The introduction of 224G PAM4 technology plays a pivotal role in the evolution of data center connectivity. With unprecedented speed, enhanced bandwidth, and robust system architecture, this Gigabit Ethernet solution is set to redefine the capabilities of data centers, enabling them to keep pace with the rapidly advancing landscape of AI and data-intensive applications.
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XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.
Revolutionizing Data Transmission with UltraPass ... - Amphenol CS
PCIe® Gen 7.0 Doubles Data Rate to 128 GT/s For Data-Intensive Markets Feb 6, 2025
Reversible USB Type C connectors for Modern Consumer Applications
Amphenol provides USB Type C that supports a variety of protocols such as USB2.0/3.0/3.1.The Lite version of USB 2.0 Type C connectors come with top and middle mount options in 16 pins.
News & Press Releases | Media | News & Events | Amphenol
Engineers can design faster with free E-CAD and M-CAD models for Amphenol Communication Solutions (ACS) connectors available on the Amphenol San Francisco, CA – (September 27, 2022) - Amphenol Communication Solutions, a world leader in interconnect solutions. and SnapEDA, the first search engine for electronic design, are releasing over 21,000 new digital models to help designers bring their ...
Cell Connection Systems in e-Mobility - Amphenol CS
FlexLock™ is compliant with USCAR-T2V2 and LV-214 S3 specs, with 2A per contact for high power. It has 2 pitch options, standard on 2.54mm and 3.20mm for larger creepage and clearance distances. FlexLock™ is built around a reliable dual beam contact system for excellent electrical performance and offers an active latch and Connector Positioning Assurance (CPA) to ensure a reliable ...
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XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.
What are the top differences between DDR4 and DDR5? - Amphenol CS
Data and its associated storage are fundamental to any computing application, ranging from notebooks and laptops to sophisticated servers and data centers.
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XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.
Maximizing Network Efficiency with our High-Performing OSFP Connectors
In this blog, we’ll break down and understand OSFP connectors, their features, benefits, and specifications. What is an OSFP? Octal Small Form-factor Pluggable (OSFP) is a pluggable form factor developed by the OSFP MSA group, which was launched by Google and led by Arista Networks.
Popular Pin Retention Designs - Amphenol CS
The contact pin’s shape, design and retentions are indeed among the key considerations for choosing a connector. Let us discuss about some of the most common and cost-effective pin retention designs that affect the performance of any connector.
ExaMAX2® Connector System: Elevating Performance and ... - Amphenol CS
In this blog, we delve into the remarkable features, benefits, and significance of ExaMAX2®, the next-generation connector system that promises to redefine the standards of data transmission.
IT Datacom | Markets - Amphenol
XCede® HD2 DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. ...
Flex-to-Board: Compact and Reliable Interconnect Solutions - Amphenol CS
FlexFast ™ Flex-to-Board: Gold plating process for terminals: Reduces the force required for the mating and un-mating process ensuring smooth connections. Max 8.00mm height: This feature is a space-saver as it allows for designs in compact applications. Connector Position Assurance (CPA) & Flex Position Assurance (FPA): Ensures connectors are properly mated, and locked together as well as ...
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BLOOMINGDALE, Ill.--(BUSINESS WIRE)--Apr. 7, 2022-- PCTEL, Inc. (Nasdaq: PCTI), a leading global provider of wireless technology solutions, today announced a strategic alliance with Stargent IoT, an Internet of Things (IoT) company providing IoT solutions for an array of use cases for smart manufacturing, process automation and asset tracking.PCTEL’s alliance with Stargent IoT will provide ...
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Market leading backplane connector families - XCede®, Paladin®, and ExaMAX ®. Proven reliability of passive twin ax copper coupled with advanced wire attachment and 100% high speed test coverage provides peace of mind. FEATURES.
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XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.
Amphenol Partners with Keysight and MultiLane for Demos
Amphenol is partnering with Keysight and MultiLane at DesignCon 2025 to showcase cutting-edge technology at their respective booths this year. We are excited to invite you to attend them and interact with our experts and gain insight on the latest products and technologies we will be showcasing.
Amphenol showcases its leading high speed interconnect at DesignCon 2024
As the tech world converges in the heart of innovation at the Santa Clara Convention Center on January 31 st and February 1 st, 2024 for DesignCon, Amphenol will make a mark with pioneering solutions in interconnect technologies at Booth #833.. Date: January 31 st and February 1 st Time: 11 AM - 6 PM Venue: Santa Clara Convention Center, Great America Parkway, Santa Clara, CA
Power Up with Amphenol: Exploring Applications of Battery Connectors
The future of technology is focused on energy efficiency and sustainability. The approach lies in environmentally friendly battery-powered solutions. The innovation of e-bikes, electric forklifts, and Energy Storage Systems is a significant step toward this future. Amphenol is at the forefront of th
Broadband | Markets - Amphenol
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
Microsoft Word - gs-20-070_c.doc - Amphenol CS
AirMax VS, Zipline and XCede high speed connector system. The distance between backplane and front edge of the daughter card is 12.5mm. 4.2.2 HCI contact sequencing compatibility. There are two available mating lengths and associated wipe distances, which are controlled by changing the Header contact length.
Shielded Connectors for Industrial Applications - Amphenol CS
BergStak ® 0.80mm Shielded Connectors. Bergstak ® shielded connector with 0.80mm pitch is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. The shielded design of these connectors provides superior EMC performance and significantly reduces coupling inductance leading to excellent electromagnetic compatibility.
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LUTZE Inc. 13330 South Ridge Drive • Charlotte, North Carolina 28273 • USA Phone: 704-504-0222 • Fax: 704-504-0223 • E-Mail: info (at) lutze.com
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XCede® | Backplane Connectors | Amphenol While maintaining the same mating interfaces, XCede connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.
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AT04-2P-R120YEL 2-Way, CAN bus Receptacle, 120 Ohm Resistor, NI Pins, Wedgelock, Yellow
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Secures GS frames to concrete floors in Zone 4 seismic areas. Anchor has a recommended rating of 3,220 lbs. tensile and 5,420 lbs. shear strength.
Circular Connectors for Industries - Amphenol CS
A circular connector can be defined as a circular interface with cylindrical contact housing. These connectors are used in various industries for data, signal and power connections in the AI, military, aerospace, data, communication, and manufacturing.
PCIe Gen 5 CEM Connector & Add-In Card PCB Design Optimizations
Amphenol is proud to announce that Yifan Huang and Stephen Smith will present a technical paper titled “PCIe Gen 5 CEM Connector and Add-In Card PCB design optimizations” at DesignCon 2019.
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XCede® | Backplane Connectors | Amphenol TB-2210 Removal and Reinsertion Process; TB-2217 Daughtercard Removal and Replacement; TB-2212 Stacker PF Installation; Overview Part Numbers Configure Your Product Choose Your Configuration Target Markets & Applications.
Solving Cooling Interconnects for Next-Gen Data Centers and AI Applications
High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology. Power requirements for AI model training are increasing to over 100kW per rack in some use cases, of which air-cooling fans alone account for up to 15% of server power cons
High Speed Connectors | Products - Amphenol
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. ...
Tag Archives: LVDS - amphenol-cs.com
Standards and specifications from various organizations provide a guideline to manufacturers in measuring the quality of their product. This helps to ensure end customers are purchasing a trustworthy and high performance product.
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High Power Contacts Amphenol Aerospace's development of High Power Contacts is the foundation of our new High Power Products. The High Power Contacts allow for greater current carrying capacity, or amperage, and are able to withstand higher temperatures in the same sizes as current Mil-Spec style pin and socket contacts.Our Temper Grip Contacts which utilize a stainless steel napkin ring to ...
High-Performance Industrial Computing with CompactPCI Serial - Amphenol CS
CompactPCI is an architecture for industrial computers that combines PCI signaling protocols with Eurocard-type connectors. Introduced over 20 years ago, it continues to be a successful architecture.
SAS/PCIe 4.0 – The Reliable Standard for Enterprise SSD - Amphenol CS
The Solid State Drive (SSD) market is expected to grow rapidly in 2019. Amphenol ICC’s 68 position SAS/PCIe 4.0, connectors come with 16GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers.
Mobile Networks | Markets - Amphenol
XCede Plus Backplane Connector DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.
Power Connectors | Products | Amphenol
XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required ...
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Amphenol offers a range of power interconnect solutions ideal for various industrial, energy storage, and EV charging applications. The BarKlip ® XP300 and XP200 busbar mounted connectors are designed to distribute up to 300A and 200A, respectively, to single pole busbars with ultra-low end-of-life contact resistance.
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XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.
Solutions for OCP Server and Storage - Amphenol CS
Amphenol contributes high-performance interconnects for OCP-specified server components, including acceleration modules, system security, and control modules, and I/O board NICs.
Learn All About Shielding Electro Magnetic Interferences (EMI)
We have a wide range of connectors with EMI shielding, suitable for various applications. These include OCTIS I/O, Modular & Magnetic Jacks, and BergStak® 0.40mm Floating Board-to-Board Connector.
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XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.
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Search Results for c10-6426 Amphenol C10-731162-000(long) 70A C10-729922-000 (for 8AWG) C10-747999-000 (for 10AWG) POWERBLOK™ WTB Product Data 12 www.amphenol-industrial.com. 14 PGY™ Type Example Sizes Rated Current Application Mated Part Above Board (Solder) 3.6mm, 5.7mm 35~120+A Configured to customer applications Above Board HD Version
IDC vs Crimp Termination: A Guide to Choosing the Best - Amphenol CS
When it comes to a connector design, engineers are often confused about the choice between IDC and crimped contacts. Both being very reliable and efficient connector systems, it mainly depends upon the end application.
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The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings.
Tag Archives: DensiLink - Amphenol CS
Technological advancements are pushing the boundaries of what robots can achieve. Vision and sensing technologies in robots are at the heart of these advancements, playing a crucial role in enabling intelligent decision-making and navigating complex environments
Tag Archives: OSFP - Amphenol CS
The introduction of 224G PAM4 technology plays a pivotal role in the evolution of data center connectivity. With unprecedented speed, enhanced bandwidth, and robust system architecture, this Gigabit Ethernet solution is set to redefine the capabilities of data centers, enabling them to keep pace with the rapidly advancing landscape of AI and data-intensive applications.
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XCede ® HD2. MATERIAL § Contact Finish Area: Gold § Contact Base Metal: High performance copper alloy § Housings: Glass reinforced polyester (LCP) ELECTRICAL PERFORMANCE § Signal Contact Current Rating: 1A § Contact Resistance Change: 10mΩ max.
Power Connectors | Products | Amphenol
XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required ...