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BLOOMINGDALE, Ill.--(BUSINESS WIRE)--Apr. 7, 2022-- PCTEL, Inc. (Nasdaq: PCTI), a leading global provider of wireless technology solutions, today announced a strategic alliance with Stargent IoT, an Internet of Things (IoT) company providing IoT solutions for an array of use cases for smart manufacturing, process automation and asset tracking.PCTEL’s alliance with Stargent IoT will provide ...

High-performance data center and AI workloads are power-intensive, outpacing efficiency improvements in air-cooling technology. Power requirements for AI model training are increasing to over 100kW per rack in some use cases, of which air-cooling fans alone account for up to 15% of server power cons

XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.

Secures GS frames to concrete floors in Zone 4 seismic areas. Anchor has a recommended rating of 3,220 lbs. tensile and 5,420 lbs. shear strength.

CompactPCI is an architecture for industrial computers that combines PCI signaling protocols with Eurocard-type connectors. Introduced over 20 years ago, it continues to be a successful architecture.

The future of technology is focused on energy efficiency and sustainability. The approach lies in environmentally friendly battery-powered solutions. The innovation of e-bikes, electric forklifts, and Energy Storage Systems is a significant step toward this future. Amphenol is at the forefront of th

Amphenol's leading the industry in OSFP cable development. Our Electronics Products 'Product of the Year' award-winning OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with 25G/lane channel NRZ up to 112G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G, 400G, and 800G per cable assembly.

Amphenol offers a range of power interconnect solutions ideal for various industrial, energy storage, and EV charging applications. The BarKlip ® XP300 and XP200 busbar mounted connectors are designed to distribute up to 300A and 200A, respectively, to single pole busbars with ultra-low end-of-life contact resistance.

BergStak ® 0.80mm Shielded Connectors. Bergstak ® shielded connector with 0.80mm pitch is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. The shielded design of these connectors provides superior EMC performance and significantly reduces coupling inductance leading to excellent electromagnetic compatibility.

Amphenol is proud to announce that Yifan Huang and Stephen Smith will present a technical paper titled “PCIe Gen 5 CEM Connector and Add-In Card PCB design optimizations” at DesignCon 2019.

Data and its associated storage are fundamental to any computing application, ranging from notebooks and laptops to sophisticated servers and data centers.

Standards and specifications from various organizations provide a guideline to manufacturers in measuring the quality of their product. This helps to ensure end customers are purchasing a trustworthy and high performance product.

Apart from this Amphenol's high power backplane connectors include high-speed XCede ® used in data centers, fully shielded I/O interconnect system SOFIX ®, DIN-41612 based high and medium power DIN connectors, and Millipacs ® 2.00mm modular board-to-board or cable-to-board Hard Metric Hybrid connectors. High-Power Card Edge Connectors

The Solid State Drive (SSD) market is expected to grow rapidly in 2019. Amphenol ICC’s 68 position SAS/PCIe 4.0, connectors come with 16GT/s (PCIe lanes) and 24Gb/s (SAS lanes) speeds to meet the demands of next-generation servers.

Technological advancements are pushing the boundaries of what robots can achieve. Vision and sensing technologies in robots are at the heart of these advancements, playing a crucial role in enabling intelligent decision-making and navigating complex environments

XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.

Amphenol contributes high-performance interconnects for OCP-specified server components, including acceleration modules, system security, and control modules, and I/O board NICs.

XCede Plus Backplane Connector DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.

When it comes to a connector design, engineers are often confused about the choice between IDC and crimped contacts. Both being very reliable and efficient connector systems, it mainly depends upon the end application.

XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures.