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Next-generation AirMax VSe® connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backward mating-compatible interfaces to existing AirMax VS® connectors with minimal changes to connector footprints.

HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI AirMax VS® 85Ohms connectors are optimized to minimize impedance discontinuities and signal loss in 85Ohms channels. The connectors' mating interfaces also satisfy demands for backward compatibility to legacy 100 Ohms product interfaces ensuring a smooth transition to next-generation designs.

AirMax VS® high-speed signal connectors from Amphenol ICC meet the dimensional and electrical requirements described in the Compact PCI® Serial (PICMG CPCI-s.0) Specification developed by the PCI Industrial Computer Manufacturers Group (PICMG). Connections between a front system or peripheral board and backplane are accomplished using right-angle headers and vertical receptacles.

AirMax VS® coplanar connectors permit mating two boards in the same plane. The AirMax family includes many coplanar configurations including 3-, 4- and 5-Pair per column connectors with column pitch of 2mm and 3mm. This family also includes 100 Ohms versions for the broad market as well as 85Ohms versions for other computer architectures. These connectors can accommodate 12.5Gb/s applications.

AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.

AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.

AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.

Multiple options for alternate-to-cadmium platings, including Durmalon, Black Zinc Nickel, and the new AP-93 1000-hour salt spray approved plating. Amphenol uses the RoHS requirements and the latest revisions to the MIL-DTL-38999 specification to develop these platings.

Various build to print busbar including assembly such as diffusion bonding, induction welding, laser welding, Frictional stir welding,overmolding . Various insulation using heatshrinktube, powercoating,overmolding.. Busbar Application includes, connectivity for Power Electronics, Converter, Battery Pack, Batter Managment system, Onboard Charger , Ciruit Breakage and charging unit

AL & AM is available in a variety of contact forms and load specifications, and LED lights indicate the operational status of coil on or off. It is suitable for debugging personnel to test the circuit manually.