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Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market including Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks.
Micro SD and SD Card Sockets
MEMORY CARD CONNECTORS WITH SUPPORT FOR UHS-I AND UHS-II
Micro SD and SD card sockets are user-friendly and ideal for use in portable devices such as digital cameras and mobile phones. They are also suitable for server applications as well as automotive devices, notebooks, and servers.
microSD Express Connector
Amphenol is the first in the industry to offer card sockets for both microSD Express and Micro SD cards (UHS-I). The 17 pin microSD Express connector is capable of achieving high speeds up to 985MB/s and meeting PCIe® 3.0 requirements. The connector enables microSD Express platform to reach its full potential; making microSD Express card possible to serve as a removable Solid State Drive (SSD).
MicroSpace™ Crimp-To-Wire Connector Platform
MicroSpace™ Crimp-to-Wire connector platform's unique design enables LV214 Severity-2 and performs at 1.27mm, 1.5mm and 1.8mm pitch. MicroSpace™ will be available in single and double row versions, with top and side latch configuration.
MicroSpace™ High Voltage selective loaded Crimp-to-Wire Connector Platform FCI BasicsFCI Basics
MicroSpace™ High Voltage selective loaded Crimp-to-Wire connector platform's unique design enables LV214 Severity-2 and performs at 3.81mm, 6.35mm, and 8.89mm pitch with 400V, 800V and 1200V. MicroSpace™ High Voltage selective loaded will be available in a staggered version with a top latch configuration.
MicroSpaceXS™ 1.27mm Unsealed Crimp-to-Wire Connector Platform
COMPACT, ROBUST AND VERSATILE CONNECTOR SYSTEM
MicroSpaceXS™ Crimp-to-Wire connector platform's unique design meets LV214 up to Severity-3 and up to USCAR-T4V2 specifications. These 1.27mm pitch connectors come with a current rating up to 4A per contact making them ideal for higher power applications.
MicroSpaceXS™ 1.27mm Waterproof Crimp-to-Wire Connector Platform
MicroSpaceXS™ Waterproof connector platform's unique design meets LV214 up to Severity-3 and up to USCAR-T4V2 specifications. These 1.27mm pitch connectors come with a current rating up to 3A per contact making them ideal for higher power applications. MicroSpaceXS™ waterproof connectors are available in staggered pin configuration and in Wire-to-Wire and Wire-to-Board configurations.
Micro-TCA Card Edge Connectors
FULLY COMPLIANT CONNECTOR FOR ADVANCED MC™ MODULES
MicroTCA (μTCA) vertical card edge connectors provide 170 contacts on a 0.75mm pitch and enable Advanced MC™ modules to be plugged directly into a backplane. MicroTCA card edge connectors' conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.
Micro USB 2.0
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.
Micro USB 2.0 Connector
FCI Basics Micro USB 2.0 connectors deliver a data transfer rate up to 480Mb/s and are characterized by their high-speed signal stability. This smaller version of the Mini USB 2.0 connector while complying with the physical, electrical, and environmental standards of the micro form factor, supports 1.8A and 3A currents for fast charging.
Micro USB 3.1 GEN 1
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.