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XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.

DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.

The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.

XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required by today's systems.

XFP is a 30pos 0.8mm pitch SMT receptacle designed to support 10 Gigabit Fibre Channel and Gigabit Ethernet with the ability to extend performance to 14 Gbps. It is constructed from a metal frame and the cage assembly is to be bezel-mounted to an I/O panel with compliant pins for pressing onto the host PCB. Its single row cage configuration requires less space & is cost-optimized.

XFP 10G optical transceivers include SR, LR, ER, ZR and support Duplex, BiDi, CWDM, and DWDM solutions. They adopt an LC interface and are compatible with IEEE802.3ae, XFP MSA, and other standards. XFP 10G optical transceivers have the characteristics of low power consumption, small size, and high speed. They are most commonly used in Transmission, Storage Area Networks, and other environments.

Amphenol LTW's X-Lok Series connectors are presented in various sizes for power, signal, and hybrid applications for fast, simple, and reliable connections. Features a push-lock mechanism for intuitive mating with AUDIBLE and TACTILE feedback.

YK50B & YK44B are designed with nuts with greater screw torque and prevent torsion from reaching the terminal when screwing. The structure is simple and firm, and the connection is safe and reliable.

Amphenol LTW ZConnect® LV214-Compliant Connectors are low-profile connectors (8mm maximum mated height) for space-saving. ZConnect Connectors are robust enough to meet the automotive requirements of LV214 (VW75174). The series ranges from 8 to 40 contacts at 1A up to 120VDC with 0.9mm / 1.8mm / 2.7mm pitch. The connectors include mated and unmated versions and an IPx67 option.

Zeus series is a High voltage Din-Rail Connector that can be used as a high voltage terminal block. 5KV or 7KV Available in 2 or 3 contacts versions. Snap-in RADSOK Contact technology for 6AWG, 8AWG, and 12AWG. The connector is designed with Creepage/Clearance in accordance with5KV IEC60079-7 guidance