All Products

Piezo Technologies’ custom piezoceramic composites offer improved and tunable acoustic matching, higher bandwidth, and faster ringdown characteristics, compared to traditional piezoceramics. Applications include underwater sonar, handheld sonar, underwater buried object detection, and NDT. We can provide custom sensing elements as well as complete build-to-spec ultrasonic transducers.

Piezo Technologies produces advanced piezoelectric ceramics for use in ultrasonic transducers. Our wide range of high quality piezoelectric ceramic materials includes modified Lead Zirconate Titanate, both hard PZT and soft PZT, including Navy Type PZT materials (Navy I PZT-4, Navy II PZT-5A, Navy III PZT-8, Navy V PZT-5J, and Navy VI PZT-5H).

Piezo Technologies produces high performance piezo ceramic elements for high temperature, high pressure, high vibration, and harsh environments. Customers range from naval laboratories to medical device manufacturers and oilfield equipment manufacturers. Some require only a ceramic, custom-shaped to exacting frequency and sensitivity specifications. Others contract the entire transducer.

Since 1945, EBY Electro has been the go-to for custom wire connectors, building a legacy of excellence and service. Our expert team is with you every step of the way, from innovative component design to seamless delivery and warehousing solutions. Experience the EBY Electro difference today!

Piezo Technologies customers include many prime defense contractors. We offer a comprehensive suite of services, from design and development to build-to-print contract manufacturing of ultrasonic transducers, sensors, and sub-assemblies. We absorb development work and deliver a plug-and-play acoustic component so their engineers can focus on system-level performance.

Specialty piezoceramics and custom ultrasonic transducers for challenging NDT applications: inspecting aircraft components like wings, fuselage, and engines; inspecting Oil & Gas pipelines, pressure vessels, and storage tanks; detecting cracks and fissures in tracks on railway systems; detecting wear, corrosion, cracks, and defects in power generation systems; manufacturing quality control.

CXP connector comes in a one-piece Press-Fit assembly that provides one-step placement to the board to accommodate single, ganged, or stacked connector configurations in high-density requirements. CXP system has twelve channels for up to 20 Gbps, resulting in 240 Gbps of total bandwidth. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3ba & the InfiniBand CXP12x QDR standards.

HIGH DENSITY, EXCELLENT PERFORMANCE AND RELIABILITY Amphenol's 300G CXP2 to CXP2 Active Optical Cable is a natural choice for optical cabling in data center/high-performance computing hardware applications, providing a cost-effective plug-and-play cabling solution. The CXP2 form factor delivers the highest hardware faceplate port density among existing SFF industry standards.

Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.

MIL-DTL-38999 connectors are ideally suited for shielded contacts for high-performance, high-speed interconnection applications. Insert arrangements can incorporate: coax (sizes 8, 12, and 16); twinax (sizes 8 and 12); and triax contacts (sizes 8, 10, and 12).