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Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market including Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks.

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Product DDR3 Memory Module Sockets
DDR3 Memory Module Sockets
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.

Product DDR4 Memory Module Sockets
DDR4 Memory Module Sockets
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.

Product DDR4 SO-DIMM Memory Module Sockets
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.

Product DDR4 Ultra Low Profile Memory Module Sockets
DDR4 Ultra Low Profile Memory Module Sockets
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.

Product DDR5 Memory Module Sockets (SMT)
DDR5 Memory Module Sockets (SMT)
COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023 Vertical DDR5 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR5 memory modules that conform to JEDEC MO-329. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment.

Product DDR5 SO-DIMM Connectors
DDR5 SO-DIMM Connectors
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector is available in 4.00mm height with the standard option. Sketching design of DDR5 SO-DIMM 8.00mm height with the standard option now.

Product Deep Draw Stamped Cover for BMS
Deep Draw Stamped Cover for BMS
Stamped Deep Draw cover for onboard charging , battery pack enclousre, engery storage battery module

Product Deep Space 38999
Deep Space 38999
The Deep Space 38999 Connector series is designed for extreme cold environments. They are built to retain a grommet-to-wire and contact-to-contact seal in temperatures beyond -85 °F (-65 °C), with inserts that have been cycle tested between -148 °F (-100 °C) to 392 °F (200 °C)

Product Defibrillation & Therapy
Defibrillation & Therapy
Defibrillation shock therapy demands safe, high-performance cable systems capable of transmitting up to 360 joules and 15 amperes. Bernd Richter GmbH develops customized, high-voltage-safe connectors and cables with reinforced isolation, vibration resistance for emergency use, Kevlar or steel tensile support, and full traceability via serial labeling.

Product DensiShield® High Speed Cable Connector
DensiShield® High Speed Cable Connector
Amphenol's DensiShield® I/O system is designed to support the transmission of high-speed, serial differential signals while taking customers' equipment packaging requirements into consideration. Combining high density, mechanical robustness, and ease of PCB assembly with excellent shielding and signal integrity performance means that system designers no longer have to compromise.

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