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CLASSIC HPCE® WITH ENHANCED PERFORMANCE eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.

Electrically conductive seals for frequency ranges from 15 kHz to 4 GHz: Seals for square flange sockets for installation type: Front wall and back wall, seals for sockets with single hole mounts, seals for protective caps, seals for D-SUB connectors.

Our product range is approved according to the standard VG96940-6 and includes all its variants: Seals for square flange sockets for installation type: Front wall and back wall, seals for sockets with single hole mounts, seals for protective caps, seals for D-SUB connectors.

Electrical plates for busses, electrobusses, trolleybusses, railway vehicles, including fuses, circuit breakers, relays, and ECUs connected by wire harnesses.

Full integration, in-house LRU capabilities include aluminum enclosures, rigid, flex, and panel circuit card assemblies, internal/external cable assemblies, integration, and final assembly, and fully functional testing and environmental stress screening (ESS) in order to support our customers with full turnkey solutions.

Capabilities include automated select solder, press-fit, and hand solder for through hold, single and double-sided BGA's and uBGA's, high-density packages, chip on board, lead-free, and conformal coating (UR, UL, Parylene). Process validation capabilities: 3D Solder Paste Inspection (SPI), Pre and Post-Reflow Automated Optical Inspection (AOI), 3D X-ray, and aqueous and non-aqueous cleaning.

ECUs allow for monitoring and controlling of critical applications such as Flight Controls, Avionic suites, Instrumentation, and Sensors. Electronic circuits are segregated and incorporate Front Face Panel, FPGA, MicroProcessors, and Software. We hold Part21G and PART145 certificates for production and maintenance.

ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.

Any type of antenna that is surface mounted on the PCB. Most common antenna types are ceramic chip antennas, composite material chip antennas and sheet metal antennas. The antenna design is often monopole, loop, IFA or PIFA antennas.

SV Microwave has just released a series of SMA and 2.92mm cable connectors and adapters with built-in electromagnetic interference (EMI) shielding. These interconnects feature a gasket that improves EMI shielding over similar products, resulting in minimal to no electromagnetic interference.