All Products

Medi|mate connector kits combine the familiarity of circular push-pull interconnects with Amphenol’s unparalleled commitment to quality products. Sterilizable, reliable, and robust, Medi|mate is available in multiple keying and color options, enabling fast and safe product identification wherever multiple interconnects are used.

At 132 circuits and beyond, the Medi|stac® connector series provides improved value by delivering superior signals through an ergonomic and cost-effective package. Medi|stac® was designed for easy termination of fine gauge wire to a flex circuit tail for an added adaptability in applications at a lower cost.

MedLock™| HD is a high-density 62 Contact, push-pull interconnect system designed for electro-surgical catheter applications for both reusable and disposable markets. It’s reliable, high strength, auto-latch feature allows the interconnect to couple intuitively & effortlessly for critical surgical applications. The Medlock HD connector is designed specifically for longevity, feel, and quality.

MedLock Ultra is an ultra-high density connector which can populate up to 146 pins. This connector has a large capacity in both power and bandwidth, which is perfect for most medical devices that are designed for disposal. This connector provides secure signal transmission in a small space and designed to meet most medical applications and more.

The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights

56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. Next-generation differential pair contact design for up to 56Gb/s PAM4 and NRZ performance.

Amphenol produces high-quality parts with over 90% metal density through our metal injection molding (MIM) process. The MIM process provides greater flexibility in design complexity, prevents corrosion, and provides a resistant polish. The MIM process is used on components of various applications including mobile phones, laptops, and industrial and automotive platforms.

A large range of backshells for all series to provide mechanical retention, EMI shielding, or sealing performances (M85049 series and proprietary series).

For 38999 Series III (MIL-DTL-38999/EN3645), RJTV & USBTV. They help protect protect your plugs and receptacles against dust, water, moisture, EMI.

Customer and application-specific molded components to replace metal parts for weight reduction. Consulting regarding plastic-specific design and structural requirements, tool design, and tool building.