All Products

Amphenol’s PIM-rated antennas ensure reliable connectivity for your iDAS network. High gain omni ceiling mount and directional panel antennas are available in 4x4 MIMO, 2x2 MIMO, and SISO configurations for virtually all applications. The aesthetically pleasing, ultra-low-profile antennas are lightweight and easy to install in any building or venue.

Amphenol's CooLink is an auto-grade high-speed cable for autonomous driving applications. CooLink can meet USCAR2 and LV214 spec, and high temperature up to 85℃, 105℃ and 130℃. CooLink can support PCIe Gen4 and Gen5, and is scalable to PCIe Gen6. We designed CooLink with CPA and a second lock feature to meet auto vibration tests.

Amphenol LP SlimSAS is a high-speed cable solution with low mating height, and it's a qualified cable solution by UPI1.0. LP SlimSAS can support PCIe Gen5, and its footprint is compatible with standard SlimSAS. Amphenol developed 38pin, 74pin and 124pin LP SlimSAS with straight, right-angle, and side exit plug types to provide customers a flexible system layout.

Amphenol's SlimSAS is a high-speed and robust cable assembly solution, and supports multiple industry applications such as PCIe, SAS, OpenCAPI, UPI1.0, OCP, NVME, and Ethernet. Amphenol has developed a scoop-proof connector solution with a pull tab. Amphenol develops a 38pin and 74pin solution and has been specified in the SFF group(SFF-8654).

Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.

Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.

Piezo Technologies manufactures a world-renowned line of piezoelectric ceramic materials, as well as engineered solutions and sensor designs for custom ultrasonic transducers, devices, assemblies, and systems. Piezo’s specialized piezoceramic formulations and integrated ultrasonic systems enable precision measurements, sensors, acoustic events, and more.

Our Navy Applications Military Uninterruptible Power Supplies (UPS) ensure uninterrupted power for vital systems, meeting stringent MIL-STD standards and offering features like switchover capabilities, surge protection, redundancy, intelligent battery management, and remote monitoring for sustained strategic dominance.

FCI Basics Universal Contact is an independent SMT contact that provides an electrical connection between a device and a PCB. It is manufactured as a single-piece stamped product, incorporating pre-load and anti-lift features. It can be used to connect a number of device components in any direction and configuration using the same interface.

MEMORY CARD CONNECTOR IN A NEXT-GENERATION HIGH-SPEED FORM FACTOR Universal Flash Storage (UFS) Connector is a 19-pin connector with a high read/write and transmission speed that is faster than existing memory card types. The connector is designed to meet higher speeds and storage capacity in commercial and non-commercial devices.

UPC (Universal Power Connector) is a plastic power connector series specially designed to be used in the hybrid electric vehicle market. The 2-pole and 3-pole connectors incorporate patented RADSOK® technology for higher amperage. The compact, plastic shell structure is lightweight with a small footprint, has continuous power up to 400A, and is field installable and repairable.

This series, utilizing RADSOK® socket contact, HVIL contact, and EMI shielding technologies is a ruggedized harsh environment, high power, thermoplastic rectangular connector with lever coupling and CPA (Connector Position Assurance) lock. With two or three contacts per connector and up to 450 amps possible with a standard operating temperature from -40°C to +125°C.

This series is based on MIL-DTL-26482 Series 1 with stamped & formed crimp contacts, IP67 rated, thermoplastic bayonet coupling, power and signal connector. With three insert arrangements ranging from 19 to 48 contacts per connector and up to 23 amps possible with a standard operating temperature from -55°C to +125°C.

Amphenol USB 2.0 Connector was developed to integrate a variety of existing PC I/O ports into a single interface with hot-plugging and automatic configuration capabilities. It enables increased bandwidth to enhance serial I/O throughput for a wide range of peripherals. USB 2.0 connectors offer a stable signal data transmission up to 480Mb/s.

USB2.0 & USB3.0 cordsets for harsh environments.

FCI Basics USB 2.0 connector delivers a data rate of up to 480Mb/s. The Universal Serial Bus interface is ideal for use in connecting removable storage devices into automotive multimedia systems but extends its functionality across a variety of domains in consumer, datacom, and industrial applications.

The Lite version of 16pin USB 2.0 Type C connectors come with, top and middle mount options. These connectors can deliver a speed performance of 480Mb/s, with a current rating of 5A, and power rating up to 100W. It is ideal for consumer applications such as wearable devices, power banks, smart home devices, e-cigarettes, and especially for TWS (True Wireless Stereo) headphones.

FCI Basics USB 3.0 connector delivers a data rate of up to 5Gb/s thanks to the SuperSpeed transfer mode. As a third major revision of the USB standard, it is backward compatible with USB 2.0 devices and cables. USB 3.0 is available in vertical through hole, right angle through-hole, and upright through-hole positions.

SuperSpeed USB will deliver 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency. With 5Gb/s signally rate, SuperSpeed USB 3.1 has a Sync-N-Go technology that minimizes user wait time. No device polling and lower active and idle power requirements are other significant features of these connectors. SuperSpeed USB is backward compatible with USB 2.0.

FCI Basics USB 3.1 Gen 1 SuperSpeed connector delivers 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency. Standard form-factor plug and receptacle performs up to 5Gbps and has "Sync-N-Go" technology that minimizes user wait-time. SuperSpeed USB is backward compatible with USB 2.0.