Automotive
Amphenol is a leading supplier of advanced interconnect systems, sensors and antennas for a growing array of automotive applications. In addition, we have developed advanced technology solutions for hybrid and electric vehicles and are working with leading global customers to proliferate these advanced interconnect products into next-generation automobiles. Our primary solutions for automotive include antennas, electric vehicles, engine management and control, exhaust monitoring and cleaning, hybrid vehicles, infotainment and communications, lighting, power management, safety and security systems, sensing systems, telematics systems and transmission systems.
MEG-Array®
The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly.
1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights
MEG-Array® R+
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. Next-generation differential pair contact design for up to 56Gb/s PAM4 and NRZ performance.
Metal Fabrication Components
Various build to print Metal Fabrication components and assemblies for Heavy Truck and Energy Storage system
Metal Injection Molding
Amphenol produces high-quality parts with over 90% metal density through our metal injection molding (MIM) process. The MIM process provides greater flexibility in design complexity, prevents corrosion, and provides a resistant polish. The MIM process is used on components of various applications including mobile phones, laptops, and industrial and automotive platforms.
Metal Substitution - Weight Reduction
Customer and application-specific molded components to replace metal parts for weight reduction. Consulting regarding plastic-specific design and structural requirements, tool design, and tool building.
Mezzostak® 0.50mm Pitch 5.2mm Stacked Height
Mezzostak® 0.50mm is a robust fine-pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The innovative hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.50mm mezzanine connectors are available in 120 positions with other position options provided on request.
Micro USB 2.0
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.
Micro USB 3.1 GEN 1
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.
Miniaturized Connectors
Reduced Space Connectors for Automotive Applications
Mini-FAKRA Cable Assemblies North America
Mini coaxial connectors offer a compact solution, compared to the conventional FAKRA connector. These connectors can support frequencies of up to 15GHz and data rates up to 28Gbit/s.
Minitek127® 1.27mm Wire/Cable-to-Board Connector System
FCI Basics Minitek127® 1.27mm connector system is an extensive range of modular connectors for all types of wire/ cable-to-board applications. It includes straight and right angle, surface mount and through-hole, pin headers and board receptacles in different plating variations, customized stacking headers, IDC version, available in up to 100 positions.
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform
FCI Basics Minitek MicroSpace™ Crimp-to-Wire connector platform's unique design enables LV214 Severity-2 and performs at 1.8, 1.5, and 1.27mm pitch. The connector is rated up to 100 mating cycles on Gold/GXT® contacts and enables a current rating of up to 4A per contact. LV214 Severity-2 compatibility makes this crimp-to-wire connector especially suitable for automotive applications.
Minitek MicroSpace™ 1.50mm Crimp-to-Wire Connector Platform
FCI Basics Minitek MicroSpace™ Crimp-to-Wire connector platform's unique design enables LV214 Severity-2 and performs at 1.8, 1.5, and 1.27mm pitch. The connector is rated up to 100 mating cycles on Gold/GXT® contacts and enables a current rating of up to 4A per contact. LV214 Severity-2 compatibility makes this crimp-to-wire connector especially suitable for automotive applications.
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform
FCI Basics Minitek MicroSpace™ Crimp-to-Wire connector platform's unique design enables LV214 Severity-2 and performs at 1.8, 1.5, and 1.27mm pitch. Minitek MicroSpace™ will be available in single and double row versions, with top and side latch configuration.
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform
Minitek MicroSpaceXS™ Crimp-to-Wire connector platform's unique design meets LV214 Severity-3 and USCAR-T2V2 specifications. These 1.27mm pitch connectors come with a current rating of up to 4A per contact making them ideal for higher power applications. Minitek MicroSpaceXS™ connectors are available in staggered pin configurations in vertical and horizontal orientations.
Minitek MicroSpaceXS™ Waterproof 1.27mm Crimp-to-Wire Connector Platform
Minitek MicroSpaceXS™ Waterproof Crimp-to-Wire connector platform's unique design is compatible with LV214 Severity-3 & USCAR-T2V2 specifications. These 1.27mm pitch connectors come with a current rating of up to 3A per contact - ideal for higher power applications. Available in a staggered vertical and horizontal configuration with, PIP soldering, and tin or gold plating.
Minitek® 1.50mm Wire-to-Board Connector System
FCI Basics Minitek®1.50mm connector system is the ideal solution for devices that require connectors with robust features and the ability to carry more signal lines in less space. Minitek® 1.50mm solution includes terminals, crimp housings, and PCB headers in right angle and vertical surface mount configurations in a single row design, and is available from 2 to 15 circuits.
Minitek® 2.00mm
Minitek® is Amphenol ICC's brand for BTB and wire/cable to board connectors in 2.00mm pitch. It is a fully modular system enabling all types of connections between PCBs, wires, and flat cables. Its 2mm spacing allows up to 38% space saving compared to traditional modular systems. It is available in vertical and horizontal configurations both in single and double row with 2 to 25 positions per row.
Minitek® 2.00mm - Wire-to-Board
Minitek® is FCI Basics brand for board-to-board and wire/cable-to-board connectors in 2.00mm pitch. It is a fully modular system enabling all types of connections between PCBs, wires, and flat cables. Its 2mm spacing allows up to 38% space saving compared to traditional modular systems.
Minitek® Pwr 4.2 TPA Connector System
COMPREHENSIVE SOLUTION FOR POWER APPLICATIONS WITH TPA
FCI Basics Minitek® Pwr 4.2 TPA connector system ensures that the terminal is fully seated in the housing and that the terminal will not back out of the housing during mating or when in use. AFCI TPA aligners are optional and can be used as an add-on part.