Amphenol is a world leader in the design, manufacture and supply of high-performance interconnect systems for harsh environment defense applications including vibration, pressure, humidity, nuclear radiation and severe temperature changes. We have unparalleled product breadth ranging from military specification connectors, customized high-speed board level interconnects, flexible to rigid printed circuit boards, backplane systems and integrated assemblies. Our solutions span most defense end markets including avionics, communications, engines, ground vehicles and tanks, homeland security, naval, ordnance and missile systems, radar systems, rotorcraft, satellite and space programs and unmanned aerial vehicles (UAV).
This crimp, rear-release high-power series provides an improved alternative to the older MIL-C-5015 solder type. It bridges the gap between an old connector standard and the environmental and high-performance needs of current technologies.
Low Mating Force Rectangular Connector series is one of the highest performing board-level connectors in the world with proven performance on the ground, in the air, and at sea. Utilizes the B³ brush contact system known for low mating force, stable electrical performance in high vibration, and extended service life.
Medium-sized, environmentally resistant circular connector. MIL-DTL-83723 is used for both general-purpose and high-temperature applications in commercial aerospace. With three coupling style choices- bayonet, threaded and quick-disconnect - the versatility of this family makes it increasingly popular for panel mount, box mount and line-to-line applications in aircraft.
Includes styles from Pyle National, with proven technology for severe environments in commercial and military aerospace markets. These have proven technology for severe environments and are widely used in commercial and military aerospace markets. high-temperature styles are capable of operation at 260° C/500°F.
MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.
Amphenol's Millipacs® is a 2.00mm grid Interconnection system in a hard metric configuration designed in accordance with IEC 917, IEC 61076-4-101, Telecordia GR-1217-CORE standards and fulfills Compact PCI bus architecture. Millipacs® high-temperature series addresses the market requirements for Backplane connectors compatible with higher operating temperature applications.
A complete line of AS39029 contacts for all major Mil-Spec circular connectors for MIL-DTL-38999, MIL-DTL-26482, MIL-DTL-83723, MIL-DTL-5015, MIL-DTL-22992.
MILTECH® Assemblies are the qualified family of hermetically sealed flexible RF and microwave transmission line assemblies that are optimized and qualified for commercial, military airborne, and other demanding applications.
MILTECH® Assemblies are the qualified family of hermetically sealed flexible RF and microwave transmission line assemblies that are optimized and qualified for commercial, military airborne, and other demanding applications.
MILTECH® Assemblies are the qualified family of hermetically sealed flexible RF and microwave transmission line assemblies that are optimized and qualified for commercial, military airborne, and other demanding applications.
