Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
FCI Basics 1.25mm wire-to-board connector system is designed for a wide variety of applications in Industrial, Automotive, and Consumer markets. The comprehensive range consists of terminals, crimp housings, and PCB headers in straight and RA, SMT, and through-hole configurations. It is available in 2 to 15 circuits in a single row. 1.25mm WTB solution conforms to the EU Industry Safety Standard.
Applied to Smart Home - Thermostat.
Compatible with PCB sockets, providing a variety of wiring methods.
Socket with tenon fixed can be provided for matching.
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS
X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.
XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required by today's systems.
Amphenol LTW's X-Lok Series connectors are presented in various sizes for power, signal, and hybrid applications for fast, simple, and reliable connections. Features a push-lock mechanism for intuitive mating with AUDIBLE and TACTILE feedback.
YK50B & YK44B are designed with nuts with greater screw torque and prevent torsion from reaching the terminal when screwing. The structure is simple and firm, and the connection is safe and reliable.
Zeus series is a High voltage Din-Rail Connector that can be used as a high voltage terminal block. 5KV or 7KV Available in 2 or 3 contacts versions. Snap-in RADSOK Contact technology for 6AWG, 8AWG, and 12AWG. The connector is designed with Creepage/Clearance in accordance with5KV IEC60079-7 guidance
OUTDOOR LIGHTING RECEPTACLES, BASES, AND DOMES
The FLS Series products are compliant with Zhaga Book 18. The FLS Receptacle is designed with 4 contacts for Power, DALI, and Digital I/O, and mounts on a Luminaire. The mating FLS Base /Extension Module and Dome together form the housing for a Photocell/Sensor Module assembly.
The FLM Series products are compliant with the Zhaga Book 20. Zhaga Book 20 specifies 2 position connectors identified as Luminaire Extension Module Receptacles (LEX-MR) and Luminaire Plugs (LEX-LP), used for DALI-2 (Digital Addressable Lighting Interface) applications. DALI-2 is a smart interface protocol between indoor luminaires and sensors and communication modules.